Chip Assembly With Metal Grid Array Cavities
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for manufacturing chip assemblies lack efficiency in creating reliable and accurately dimensioned cavities for electronic chip mounting, which affects the connection reliability and thermal management of semiconductor chips.
Innovation Solution
A method involving a carrier with a metal grid array having openings, attached using an attachment material to form cavities, where electronic chips are mounted within these cavities, allowing for precise alignment and improved thermal conductivity through the use of a laminate structure and conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If individual electronic chips are placed and fixed on a carrier one by one, then the manufacturing process allows for precise placement, but the productivity is low due to the sequential nature of the process
Solution Approach 1:
The carrier is segmented into multiple cavities, each capable of holding a chip. This allows multiple chips to be processed simultaneously in parallel, dramatically improving productivity while maintaining precise placement through the structured cavity design.
Solution Approach 2:
Chips are pre-placed on an intermediate carrier in a batch operation, then the entire group is transferred to the final carrier. This preliminary batch placement action eliminates sequential individual placement, improving manufacturing efficiency while preserving placement precision through the transfer mechanism.
2Productivity
If chips are placed top-down on an intermediate carrier and then commonly fixed, then the productivity is improved through batch processing, but the manufacturing precision of cavity formation deteriorates
Solution Approach 1:
An intermediate carrier serves as a mediator for batch chip placement, while the final carrier with pre-formed cavities provides the precise positioning structure. The transfer from intermediate to final carrier combines the productivity benefits of batch processing with the precision benefits of pre-formed cavities.
Solution Approach 2:
The manufacturing process is segmented into two independent stages: batch placement on intermediate carrier (for productivity) and precise cavity formation on final carrier (for precision). This segmentation allows each stage to optimize for its specific function without compromising the other.
3Ease of operation
If die attach liquid is used to mount chips in cavities and then evaporated, then the chips can be easily positioned, but the manufacturing process time increases due to the evaporation step
Solution Approach 1:
The die attach liquid step is completely removed from the process. Instead of using liquid that requires evaporation, chips are directly placed into cavities and fixed with attachment material in a single continuous operation, eliminating the time-consuming evaporation step while maintaining easy positioning through cavity guidance.
4Manufacturing precision
If a metal grid array with openings is attached to form cavities, then the dimensional accuracy of cavities is improved, but the device complexity increases due to additional components
Solution Approach 1:
The metal grid array serves multiple functions: it provides the cavity structure, defines precise dimensions through its openings, and acts as an attachment substrate. This multi-functionality achieves high dimensional accuracy without proportionally increasing complexity, as one component performs multiple critical roles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of chip connections, improves dimensional accuracy, and facilitates effective heat management, enabling efficient manufacturing of semiconductor packages for various applications.
Implementation Method 1
attaching the metal grid array to the carrier by an attachment material
Data Source
AI summary
A chip assembly includes a carrier and a metal grid array having an opening. The metal grid array is attached to the carrier by an attachment material. The metal grid array and the carrier define a cavity which is formed by the opening and the carrier. The chip assembly further includes an electronic chip mounted in the cavity.