Ultra-Thin Chip Attach Film for Uniform Stacked Package Bonding
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving a thin, uniform chip attach film that supports the stacking of semiconductor chips while maintaining structural reliability and reducing package size.
Innovation Solution
A chip attach film with an adhesive layer and an organic filler, where the filler's average particle diameter is between 0.8 and 1 times the thickness of the adhesive layer, is used to bond and fix stacked semiconductor chips, ensuring uniform thickness and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip attach film is used to bond and fix stacked semiconductor chips, then the semiconductor package can be fabricated with improved stacking capability, but the package size and thickness uniformity are compromised
Solution Approach 1:
The patent applies this principle by developing an ultra-thin chip attach film with thickness of 0.5 μm to 3 μm, which is significantly thinner than conventional attach films. This thin film still maintains sufficient bonding strength to hold stacked semiconductor chips while reducing the overall package thickness, thereby resolving the contradiction between stacking capability and package thickness.
Solution Approach 2:
The patent changes the thickness parameter of the chip attach film to an ultra-thin range (0.5 μm to 3 μm) and optimizes the filler particle diameter to be 0.05 μm to 0.5 μm. These parameter changes enable the film to achieve both thinness and sufficient mechanical strength for bonding stacked chips, resolving the contradiction between reduced thickness and maintained bonding capability.
2Length of stationary object
If the chip attach film thickness is reduced, then the package size is minimized, but the thickness uniformity and structural reliability deteriorate
Solution Approach 1:
The patent optimizes specific parameters including filler particle diameter (0.05 μm to 0.5 μm) and adhesive layer thickness (0.5 μm to 3 μm) to achieve uniform thickness distribution. This controlled parameter optimization ensures that even at ultra-thin dimensions, the film maintains sufficient thickness uniformity across the bonding area, preventing defects while minimizing package size.
Solution Approach 2:
The patent uses a composite material system consisting of adhesive polymers and inorganic fillers (such as silica or alumina particles). This composite structure provides both the thinness required for small package size and the mechanical strength and thickness uniformity required for structural reliability, resolving the contradiction between minimized package size and maintained manufacturing precision.
3Length of stationary object
If a thin chip attach film is used, then the package size is reduced, but the mechanical strength and thermal expansion properties are compromised
Solution Approach 1:
The patent employs composite materials comprising adhesive polymers reinforced with inorganic filler particles (0.05 μm to 0.5 μm in diameter). The filler particles provide mechanical reinforcement to the thin film structure, maintaining sufficient bonding strength despite the reduced thickness. This composite approach enables the package to be miniized while preserving mechanical strength.
Solution Approach 2:
The patent optimizes the filler content ratio and particle size distribution to achieve the right balance between film thickness and mechanical strength. By controlling the filler concentration and size within specific ranges, the thin film maintains adequate bonding strength for stacking applications while enabling reduced package size, thus resolving the contradiction between these two parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution results in a semiconductor package with improved thickness uniformity and structural reliability, enabling a reduced package size while maintaining mechanical properties and thermal expansion coefficients within acceptable limits.
Implementation Method 1
a filler dispersed in the adhesive layer and including an organic material
Implementation Method 2
an adhesive layer, and a filler dispersed in the adhesive layer
Data Source
AI summary
A chip attach film includes an adhesive layer, and a filler dispersed in the adhesive layer and including an organic material, wherein a thickness of the adhesive layer is about 0.5 μm to about 3 μm, and wherein an average particle diameter of the filler is equal to or greater than about 0.8 times the thickness of the adhesive layer, and less than about 1 times the thickness of the adhesive layer.