Chip-to-Apparatus Authentication Using PUF-Based Identity Binding

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Solution Overview

Problem

The challenge lies in effectively tracking and verifying the authenticity and reliability of recycled electronic components, particularly high-value items like microcontrollers, which are often reused in critical applications without proper logistics monitoring due to their varied sources and complex recycling processes.

Innovation Solution

A method is introduced where a chip-specific characteristic variable is generated and used to securely tie a chip to an electronic apparatus through physical unclonable functions (PUFs) or nonvolatile memory (NVM) values, enabling unique identification and ensuring the chip's intended use by comparing transmitted data with stored values, thus preventing unauthorized reuse.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complete logistics monitoring of used electronic components is implemented, then reliability of component usage is improved, but device complexity and cost increase significantly

Engineering Contradiction:
Improvereliability of component usageVSAvoidlogistics monitoring complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the essential authentication function from complex logistics monitoring by implementing a dedicated authentication device within the chip that independently verifies component identity and usage history, eliminating the need for external monitoring infrastructure

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an intermediary authentication mechanism using unique identification values and authentication codes stored in the chip, which mediates between the component and the system to verify legitimacy without requiring direct connection to complex logistics monitoring systems

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If unique identification is implemented in recycled chips, then authenticity verification is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveauthenticity verificationVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent implements self-service authentication where the chip automatically generates and stores its unique identification value and authentication code during manufacturing, and performs self-verification without requiring external authentication infrastructure, simplifying the manufacturing process

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent performs preliminary authentication setup during chip manufacturing by pre-generating unique identification values and authentication codes and storing them in non-volatile memory, so that authentication is already prepared before the chip enters the recycling or reuse cycle

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8476921B2Method for supporting a tie of a chip to an electronic apparatus
Publication Date: 2013.07.02 INFINEON TECHNOLOGIES AG
  • US8476921B2 patent drawing
  • US8476921B2 patent drawing

AI summary

A method for supporting a tie of a chip to an electronic apparatus includes generating once a chip-specific characteristic variable in a chip, reading out the chip-specific characteristic variable by the chip, and transmitting characteristic data representing the read-out characteristic variable of the chip to an electronic apparatus.