Chip Device Barrier Prevents Thermal Paste Overflow

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Solution Overview

Problem

Thermal paste overflow between a chip and a sealing member or between the sealing member and a heat dissipation device leads to poor heat conduction, and when it enters a cooling liquid, it deteriorates the liquid's thermal performance.

Innovation Solution

A chip device design incorporating a substrate, at least one chip, a sealing component, a heat-conducting or heat-transferring medium, and a barrier or isolator that blocks or isolates the medium to prevent overflow and ensure effective heat transfer without contaminating cooling liquids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal paste is applied between chip and sealing member or between sealing member and heat dissipation device to conduct heat, then heat conduction is improved, but thermal paste may overflow causing poor heat conduction and deteriorating cooling liquid

Engineering Contradiction:

Improveheat conduction efficiencyVSAvoidthermal paste containment

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent introduces a sealing member as an intermediary component between the chip and heat dissipation device. This sealing member contains grooves that hold thermal paste in place, preventing overflow while maintaining thermal contact. The sealing member mediates between the need for effective heat conduction and the need to contain the thermal paste

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sealing member functions as a flexible containment structure with grooves that adapt to hold the thermal paste. The grooves in the sealing member create a contained space for the thermal paste, preventing it from flowing out while allowing thermal contact between components

Inventive Principle:

Principle #30Flexible shells and thin films

2Temperature

If thermal paste is used for heat conduction, then heat transfer performance is improved, but cooling liquid thermal performance deteriorates when paste flows into it

Engineering Contradiction:

Improveheat transfer performanceVSAvoidcooling liquid contamination

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The sealing member acts as an intermediary barrier that prevents thermal paste from contaminating the cooling liquid while still allowing heat to be transferred from the chip through the sealing member to the heat dissipation device. The grooves in the sealing member contain the paste, creating a physical barrier against the cooling liquid

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sealing member is segmented into different functional zones: heat transfer areas that contact the chip and dissipation device, and groove areas that contain the thermal paste. This segmentation allows the paste to be confined to specific regions, preventing it from flowing into the cooling liquid

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents heat medium overflow, maintains heat conduction efficiency, and keeps cooling liquids free from contamination, thereby maintaining their thermal performance.

Implementation Method 1

thermal paste is applied between a chip and a sealing member or between the sealing member and a heat dissipation device to proceed with heat conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The barrier is disposed around and blocks the heat-conducting medium

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

The isolator is disposed around and isolates the heat-transferring medium

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS20230197562A1Chip device

Publication Date: 2023.06.22 SUNONWEALTH ELECTRIC MACHINE IND CO LTD

AI summary

A chip device is provided. The chip device includes a substrate, at least one chip, a sealing component, a heat-conducting medium, a barrier, and a heat dissipation device. The at least one chip is disposed over a first surface of the substrate and has a heat transfer surface. The sealing component covers the at least one chip and has a heat transfer area thermal contacting the heat transfer surface of the at least one chip. The heat-conducting medium is disposed over the heat transfer area of the sealing component. The barrier is disposed around and blocks the heat-conducting medium. The heat dissipation device is disposed over the heat transfer area of the sealing component and on the heat-conducting medium. The chip device can block the heat-conducting medium through the barrier to prevent the heat-conducting medium from overflowing or losing between the sealing component and the heat dissipation device.