Semiconductor Chip Base Protrusion for Void-Free Thermal Conduction
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Solution Overview
Problem
Semiconductor devices face challenges in maintaining a wide safe operating area (SOA) due to voids in the connection members, which inhibit thermal conduction and lead to non-uniform temperature distribution and localized current concentration, potentially causing breakdown.
Innovation Solution
The semiconductor device incorporates a base member with protrusions that extend along the side surfaces of connection members, preventing voids from forming and moving, thereby ensuring efficient thermal conduction and maintaining a wide safe operating area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection members are used to connect semiconductor chip to base member, then electrical connection is achieved, but voids form in the connection members which inhibit thermal conduction
Solution Approach 1:
A protrusion is introduced as an intermediary structure between the connection member and the base member. This protrusion extends into the connection member and provides a physical barrier that prevents void formation, thereby maintaining thermal conduction efficiency while preserving electrical connection functionality.
Solution Approach 2:
The protrusion is pre-formed on the base member before the connection member is attached to the semiconductor chip. This preliminary structure ensures that when the connection member is installed, voids are already prevented from forming in the thermal conduction path, eliminating the need for post-assembly void prevention measures.
2Reliability
If conventional base member structure is used, then manufacturing is simple, but voids can form and move freely, causing localized current concentration
Solution Approach 1:
Instead of making the entire base member complex, only a localized protrusion is added to the base member at the critical position where the connection member attaches to the semiconductor chip. This localized modification prevents void formation without requiring complex changes to the entire base member structure, maintaining manufacturing simplicity while improving current distribution uniformity.
3Loss of energy
If protrusions are added to base member to prevent voids, then thermal conduction is enhanced, but manufacturing complexity increases
Solution Approach 1:
The protrusion is a localized feature on the base member rather than a complex overall structure. This localized modification can be integrated into existing base member fabrication processes with minimal additional steps, enhancing thermal conduction efficiency without significantly increasing manufacturing complexity.
Solution Approach 2:
The protrusion is formed as part of the base member preparation process before assembly. By incorporating the protrusion formation into the preliminary base member fabrication steps, the thermal conduction enhancement is achieved without requiring separate complex manufacturing operations, thus minimizing the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protrusions in the base member stabilize the semiconductor chip, prevent void formation, and enhance thermal dissipation, ensuring stable operation with large currents and maintaining a wide safe operating area.
Implementation Method 1
voids in the connection members, which inhibit thermal conduction
Data Source
AI summary
A semiconductor device includes a base member, a semiconductor chip, and a conductive member. The base member includes a first surface, a second surface opposite to the first surface, and a protrusion at the second surface side. The semiconductor chip is mounted on the second surface of the base member. The semiconductor chip includes first and second electrodes, a control pad, and a semiconductor part. The semiconductor part has front and back surfaces; the first electrode is provided on the back surface; and the second electrode and the control pad are provided on the front surface. The conductive member bonded on the second electrode via a connection member. The connection member includes a side surface extending along a space between the second electrode and the control pad. The protrusion of the base member overlaps the second connection member and extends along the side surface of the connection member.