Chip-on-Board Lead Layout for Higher Contact Density
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Solution Overview
Problem
Conventional chip-on-board modules face challenges in increasing chip contacts due to restricted line width and gap distances, leading to larger substrate sizes and increased manufacturing costs, with leads arrangement around the opening causing interference and size inefficiencies.
Innovation Solution
The chip-on-board module arranges leads along specific axes with included angles between 100° and 170°, preventing trace interference and increasing lead density while reducing substrate size and trace lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of chip contacts is increased to meet functional requirements, then the functionality is improved, but the substrate size must be increased due to restricted line width and gap distance
Solution Approach 1:
The patent transitions from a conventional single-axis lead arrangement to a two-axis arrangement where leads are distributed along both the first axis and the second axis. This dimensional change allows for more efficient space utilization on the substrate, enabling increased chip contact density without proportionally increasing substrate area.
Solution Approach 2:
The patent introduces a specific angular parameter (included angle between 100° and 170°) between the first axis and second axis to optimize lead distribution. By changing the geometric parameter of lead arrangement, the design achieves better trace routing efficiency and reduced interference, allowing more chip contacts within the same substrate footprint.
2Area of stationary object
If leads are arranged around the opening to reduce substrate size, then the substrate area is reduced, but the traces connecting chip contacts and leads interfere with each other
Solution Approach 1:
The patent segments the lead arrangement into two distinct groups: first leads arranged along the first axis and second leads arranged along the second axis. This segmentation separates trace routing paths, reducing interference between traces by organizing connections into different spatial zones defined by the angular relationship between axes.
Solution Approach 2:
The patent employs asymmetric lead distribution by establishing leads along two axes with a specific included angle (100°-170°) rather than symmetric arrangements. This asymmetric configuration optimizes trace routing efficiency and minimizes trace interference while maintaining compact substrate dimensions.
3Quantity of substance
If the substrate size is increased to accommodate more chip contacts, then the number of chip contacts is increased, but the manufacturing cost is increased due to equipment changes
Solution Approach 1:
By implementing a two-axis lead arrangement system, the patent increases chip contact capacity without requiring proportional increases in substrate dimensions. This allows the design to maintain compatibility with existing manufacturing equipment and processes, avoiding the need for expensive equipment changes while still achieving higher contact counts.
Data Source
AI summary
A chip-on-board module is provided. The chip-on-board module includes a chip and a substrate. The chip includes a plurality of chip contacts. The substrate includes a plurality of first leads and a plurality of second leads. The first leads and the second leads are coupled to a portion of the chip contacts. The first leads are arranged along a first axis. The second leads are arranged along a second axis. A first axis included angle is formed between the first axis and the second axis, and the first axis included angle is between 100° and 170°.