Chip-Bonded Transmitter Optical Module for Low-Loss Signal Amplification
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Solution Overview
Problem
The TDM-PON system faces a decrease in information transfer to subscribers as the branching number of the transmitter optical module increases, requiring high data rate and power, which is difficult to achieve with monolithic integration of optical output and amplifier modules without increasing module size and reducing yield.
Innovation Solution
A transmitter optical module is designed with a first package generating an optical signal using an EML chip and a second package amplifying the signal using a semiconductor optical amplifier, connected via chip-to-chip bonding and optical waveguides, with a spot-size converter to reduce coupling loss and a lens for efficient optical fiber coupling, along with a thermistor and thermal management for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If monolithic integration of optical output module and optical amplifier module is performed, then device complexity is reduced, but manufacturing precision and yield are lowered due to difficulty in optimizing both modules simultaneously
Solution Approach 1:
The transmitter optical module is divided into two separate packages: a first package containing the optical output module (EML chip) and a second package containing the optical amplifier module (semiconductor optical amplifier). This segmentation allows each module to be independently optimized and manufactured with high precision, while still achieving a compact integrated structure through chip-to-chip bonding.
2Ease of manufacture
If optical output module and optical amplifier module are interconnected using optical fiber outside each module, then manufacturing ease is improved, but device size increases
Solution Approach 1:
The optical output module and optical amplifier module are merged into a single compact transmitter optical module through chip-to-chip bonding. The modules are positioned adjacent to each other with direct optical coupling, eliminating the need for external optical fiber interconnection and reducing the overall module size while maintaining manufacturing simplicity.
3Adaptability or versatility
If branching number of transmitter optical module is increased, then adaptability is improved, but information transfer amount to each subscriber decreases
Solution Approach 1:
The transmitter optical module employs parameter changes by operating at high data rates (10 Gbps or higher) and high output power (10 dBm or higher) to compensate for the signal splitting across multiple branches. This allows the system to support high branching numbers while maintaining sufficient information transfer capacity to each subscriber through enhanced transmission capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-speed and high-power optical signal transmission with reduced optical coupling loss and efficient heat management, allowing for efficient service provision to multiple subscribers while maintaining a compact module size and low process costs.
Implementation Method 1
an electro absorption modulated laser (EML) chip bonded on the first silicon substrate and outputting an optical signal
Implementation Method 2
a semiconductor optical amplifier amplifying an optical signal provided from the first package
Implementation Method 3
a monitor photo-diode bonded on the first silicon substrate and monitoring an optical signal output from the EML chip
Implementation Method 4
an optical waveguide forming a transmission path of the optical signal from the first package to the second package
Implementation Method 5
a spot-size converter is integrated to the input/output waveguide of the semiconductor optical amplifier to reduce a coupling loss between an input optical signal and that of the semiconductor optical amplifier
Implementation Method 6
an optical fiber ferrule receiving an optical signal collected through the lens
Implementation Method 7
a thermistor configured to detect heat generated from the semiconductor optical amplifier
Data Source
AI summary
Disclosed is a transmitter optical module which includes a first package generating an optical signal; a second package bonded with the first package by using chip-to-chip bonding, having a silicon optical circuit platform structure, and amplifying the optical signal; and an optical waveguide forming a transmission path of the optical signal from the first package to the second package.