Chip Bonder Pressure Control for Overhang Crack Prevention
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Solution Overview
Problem
Existing semiconductor manufacturing processes face the risk of cracking semiconductor chips when bonding them in a stepwise manner due to uneven application of pressure, particularly on overhanging portions.
Innovation Solution
A semiconductor manufacturing apparatus is designed with multiple chip bonders that apply differentiated pressures to each semiconductor chip, using a controller to manage and adjust these pressures based on set values and thresholds to prevent cracking, and includes sensors to detect and display pressure changes for real-time monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor chips are bonded in a stepwise manner with upper chips overhanging lower chips, then bonding flexibility and stacking capability are improved, but the risk of causing cracks in the overhanging portions increases due to uneven pressure application
Solution Approach 1:
The patent applies different pressing forces to different regions of the semiconductor chip by controlling multiple chip bonders independently. Specifically, chip bonders positioned under overhanging portions apply lower pressing forces compared to those under supported regions, preventing cracks while maintaining bonding effectiveness. This local differentiation of pressing force resolves the contradiction between bonding flexibility and chip integrity.
Solution Approach 2:
The patent dynamically adjusts the pressing force parameter for each chip bonder based on its position and the local chip structure. The control unit sets different pressing force values for chip bonders corresponding to overhanging portions versus supported portions, optimizing both bonding quality and preventing damage. This parameter adjustment strategy enables reliable stepwise bonding with overhanging chips.
2Ease of manufacture
If uniform pressing force is applied by all chip bonders, then the bonding process is simple and consistent, but cracks occur in overhanging portions due to excessive pressure on unsupported areas
Solution Approach 1:
The patent implements local quality by assigning different pressing force characteristics to different chip bonders based on their positions. Chip bonders under overhanging portions are configured to apply lower pressing forces, while those under supported regions apply higher forces. This localized differentiation prevents cracks without significantly complicating the overall bonding process, as the control unit automatically manages the force distribution.
Solution Approach 2:
The patent segments the bonding process by dividing the chip bonding operation into multiple independent actions, each controlled by a separate chip bonder with customized pressing force settings. This segmentation allows each bonder to optimize its pressing force according to local chip conditions, preventing cracks in overhanging portions while maintaining overall process efficiency.
3Reliability
If differentiated pressing forces are applied to prevent cracks, then chip integrity is improved, but the control system complexity increases due to multiple pressure sensors and coordination requirements
Solution Approach 1:
The patent employs self-service by enabling each chip bonder to independently detect and adjust its own pressing force through integrated pressure sensors and control units. Each bonder autonomously monitors its pressing force and makes necessary adjustments without requiring complex centralized coordination, thereby reducing overall system complexity while maintaining differentiated pressing forces for chip integrity.
Solution Approach 2:
The patent implements feedback control by equipping each chip bonder with a pressure sensor that continuously monitors the pressing force applied to the semiconductor chip. The control unit receives this feedback and automatically adjusts the pressing force to maintain optimal values, preventing both excessive force that causes cracks and insufficient force that compromises bonding. This feedback mechanism simplifies control by using decentralized, autonomous adjustment.
4Measurement precision
If multiple pressure sensors and control units are used to monitor and adjust pressing forces, then pressure control precision is improved, but the device complexity and cost increase
Solution Approach 1:
The patent applies self-service by giving each chip bonder its own pressure sensor and control unit that independently monitor and adjust pressing forces. This decentralized approach achieves high measurement precision for pressure control while avoiding the need for a complex centralized control system. Each unit serves itself by autonomously detecting and correcting pressing force deviations, reducing overall system complexity despite the presence of multiple sensors.
Solution Approach 2:
The patent segments the pressure control function by assigning dedicated pressure sensors and control units to individual chip bonders rather than using a shared control system. This segmentation enables precise local pressure measurement and control for each bonding position, particularly important for differentiating forces under overhanging versus supported regions, while keeping each control unit simple and manageable.
Data Source
AI summary
An apparatus includes first and second chip bonders. The first chip bonder includes a first holder, a first shaft, a first driver driving the first shaft, and a first pressure sensor detecting a first pressure at which the first driver presses a chip against a bonding target. The second chip bonder includes a second holder, a second shaft, a second driver driving the second shaft, and a second pressure sensor detecting a second pressure at which the second driver presses the chip against the bonding target. A storage stores a first set value of the first pressure and a second set value of the second pressure. A controller controls the first chip bonder to set the first pressure to be the first set value and controls the second chip bonder to set the second pressure to be the second set value.