Chip Bonding Device Batch Processing Throughput
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Solution Overview
Problem
Conventional flip-chip bonding devices have low throughput, limiting their ability to support mass production due to serial processing, where only one chip can be bonded per press cycle.
Innovation Solution
A chip bonding device with multiple motion stages, a chip pickup element, a transfer carrier, a chip adjustment system, and a bonding stage, all controlled by a central system, allowing for batch processing and accurate alignment and bonding of multiple chips simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If serial processing is used to bond one chip per press cycle, then bonding accuracy can be maintained, but throughput is very low and mass production cannot be achieved
Solution Approach 1:
The patent divides the chip bonding process into distinct segments: a first press unit for initial bonding and a second press unit for subsequent bonding. This segmentation allows different chips to be processed in parallel at different stages, transforming the serial process into a parallel pipeline that significantly increases throughput while maintaining bonding accuracy through specialized press units
Solution Approach 2:
The first press unit performs preliminary bonding actions on chips before they reach the second press unit. By completing initial bonding operations in advance, the system prepares chips for final bonding, enabling overlapping processing cycles and improving overall throughput without compromising the precision of the final bonding step
2Productivity
If multiple chips are processed simultaneously, then throughput increases, but alignment precision and bonding accuracy become more difficult to maintain
Solution Approach 1:
The patent applies different quality levels to different press units: the first press unit is designed for high-speed preliminary bonding with acceptable precision, while the second press unit is designed for high-precision final bonding. This local differentiation allows the system to achieve both high throughput and high alignment precision by matching press unit capabilities to specific process requirements
Solution Approach 2:
The first press unit acts as an intermediary that prepares chips for the second press unit. It performs preliminary positioning and bonding that facilitates the subsequent high-precision operation, serving as a bridge between high-speed processing and high-precision bonding requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly increases throughput by enabling the batch bonding of chips with high accuracy, balancing chip picking, alignment, and bonding times, thus enhancing production efficiency.
Implementation Method 1
a first suction cup connected to the first motion mechanism and configured to retain a target chip by suction
Data Source
AI summary
A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.