Multi-Head Chip Bonding With Feedback Alignment Compensation
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Solution Overview
Problem
Advanced packaging technologies face challenges in precisely bonding multiple chips due to tilting of the carriage about a center of rotation, causing alignment errors and misalignment of chips on the substrate, exacerbated by external disturbances.
Innovation Solution
A method and system that involves alternating between receiving renewed position information of the substrate chuck and repositioning bonding heads based on this information until each chip contacts the bonding surface, ensuring accurate alignment and minimizing alignment errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple bonding heads bond chips to a substrate simultaneously, then productivity is improved, but alignment precision deteriorates due to carriage tilting
Solution Approach 1:
The system continuously monitors the substrate chuck position and feeds this information back to the bonding heads. Sensors detect the actual position of the substrate chuck, and this position information is used to dynamically adjust the bonding heads' positions, ensuring that alignment precision is maintained even when multiple bonding heads operate simultaneously and cause carriage tilting.
Solution Approach 2:
The bonding heads are designed with dynamic positioning capabilities that allow real-time adjustment during the bonding process. Rather than being fixed in position, the bonding heads can dynamically adapt their locations based on substrate chuck movements, enabling both high productivity through simultaneous bonding and high precision through continuous repositioning.
2Adaptability or versatility
If the carriage is designed to support multiple bonding heads, then device capability is improved, but stability deteriorates due to rotation about center of rotation
Solution Approach 1:
Position sensors continuously monitor the substrate chuck location, and this feedback information is used to compensate for carriage instability. The system detects tilting and positional deviations caused by multiple bonding heads operating simultaneously, and actively corrects these deviations through real-time position adjustments, maintaining both versatility and stability.
Solution Approach 2:
The patent replaces purely mechanical rigid positioning with a sensor-based active compensation system. Instead of relying on mechanical rigidity to prevent carriage tilting, the system uses electronic sensing and control to detect and correct positional deviations, substituting mechanical stability requirements with electronic feedback control.
3Manufacturing precision
If bonding heads are repositioned continuously to maintain alignment, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system uses a feedback mechanism where position sensors monitor the substrate chuck and this information automatically triggers repositioning of bonding heads. The feedback loop is designed to activate only when necessary, based on actual position deviations, rather than continuous repositioning, thereby maintaining precision while managing system complexity through event-driven control.
Solution Approach 2:
The bonding system performs self-correction through automated feedback control. The position sensing and repositioning functions are integrated into the system, allowing it to automatically compensate for alignment deviations without external intervention. This self-service capability maintains high precision while the automation manages the complexity of coordination between multiple bonding heads.
Data Source
AI summary
A method for bonding chips includes initially positioning a first bonding head at a first predetermined location relative to an initial position of a substrate chuck, wherein the first bonding head holds a first chip and wherein the substrate chuck supports a bonding surface, initially positioning a second bonding head at a second predetermined location relative to the initial position of the substrate chuck, wherein the second bonding head holds a second chip, alternating between receiving renewed position information of the substrate chuck and repositioning the first bonding head based on the received renewed position information until the first chip contacts the bonding surface, and alternating between receiving renewed position information of the substrate chuck and repositioning the second bonding head based on the received renewed position information until the second chip contacts the bonding surface, and bonding the first chip and the second chip to the bonding surface.