Micro LED Chip Bonding Alignment With Electrostatic Fluid Flow
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Solution Overview
Problem
Current micro transfer printing (μTP) technology for transferring micro LED chips from a source substrate to a target substrate has lower transfer efficiency and higher costs, necessitating an improved method for alignment and bonding.
Innovation Solution
A method utilizing insulation fluid and electrostatic forces for chip alignment, combined with microfluidic technology, to enhance the transfer efficiency and reduce costs by enabling batchwise transfer of micro LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional micro transfer printing (μTP) technology is used for transferring micro LED chips, then the transfer process can be completed, but the transfer efficiency is low and costs are high
Solution Approach 1:
The chip bonding structure is divided into multiple independent bonding structures, each capable of being aligned and bonded independently. This segmentation enables batchwise processing of multiple chips simultaneously, thereby improving transfer efficiency while reducing per-unit manufacturing costs
Solution Approach 2:
Alignment bonding structures and chip bonding structures are prepared in advance with predefined geometric features before the transfer process. This preliminary preparation enables rapid alignment during batch transfer, significantly improving transfer efficiency and reducing overall manufacturing time and cost
2Manufacturing precision
If conventional alignment methods are used for chip bonding, then alignment can be achieved, but the alignment precision is insufficient for high-precision batch transfers
Solution Approach 1:
The patent replaces conventional mechanical alignment methods with an electrostatic alignment system. Insulation fluid and electrostatic forces are used to achieve precise alignment of chip bonding structures with alignment bonding structures, enabling high-precision batch transfers without complex mechanical positioning mechanisms
Solution Approach 2:
Insulation fluid is introduced as an intermediary medium between the chip and target substrate during the alignment process. This fluid enables electrostatic interaction while maintaining electrical isolation, facilitating precise alignment through electrostatic forces without direct mechanical contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves chip transfer efficiency and reduces costs by using insulation fluid and electrostatic forces for precise alignment and bonding of micro LED chips to the target substrate, facilitating high-precision and high-efficiency batch transfers.
Implementation Method 1
applying a charge of a first polarity to the first alignment bonding structure, applying a charge of a second polarity to the first chip bonding structure, and injecting an insulation fluid flowing in a first direction into the sealed chamber, such that the first chip bonding structure is aligned with the first alignment bonding structure
Implementation Method 2
injecting an insulation fluid flowing in a first direction into the sealed chamber, such that the first chip bonding structure is aligned with the first alignment bonding structure
Data Source
AI summary
Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.