Chip Bonding Apparatus with Parallel Modules and Guide Tracks
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Solution Overview
Problem
Conventional flip-chip bonding processes are serial, time-consuming, and have low yield and accuracy, making them unsuitable for mass production and precise bonding.
Innovation Solution
A chip bonding apparatus with a separation module, bonding module, transportation device, and control device that enables batch pickup, transportation, and bonding of chips, incorporating guide tracks and carriers for precise alignment and adjustment, ensuring continuous operation of modules for improved yield and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional serial chip bonding process is used, then the bonding process is simple to implement, but the production time is extended and productivity is low
Solution Approach 1:
The bonding apparatus is divided into multiple independent bonding modules (first bonding module, second bonding module, etc.) that can operate simultaneously. Each module has its own suction head and pressing mechanism, allowing parallel processing of multiple chips. This segmentation transforms the serial process into a parallel process, significantly increasing productivity without requiring a single complex monolithic structure.
Solution Approach 2:
The patent transitions from a single-dimensional serial processing approach to a multi-dimensional parallel processing architecture. Multiple bonding modules are arranged in different spatial positions, enabling simultaneous bonding operations at different locations. This dimensional expansion allows multiple chips to be bonded in parallel, dramatically improving throughput while keeping individual module designs relatively simple.
2Manufacturing precision
If a conventional serial chip bonding process is used, then the apparatus structure is simple, but the bonding accuracy is low
Solution Approach 1:
The alignment system performs preliminary alignment operations before the actual bonding process. The alignment mark detection and positioning are completed in advance, ensuring that chips are correctly positioned on the substrate before pressing. This preliminary alignment action guarantees high bonding accuracy while the subsequent parallel bonding operations maintain high productivity.
Solution Approach 2:
An alignment system acts as an intermediary between the chip placement and bonding processes. This alignment system detects alignment marks and adjusts positions to ensure precise bonding. The intermediary alignment function decouples the accuracy requirement from the speed requirement, allowing high-precision alignment to be performed before parallel bonding operations commence.
3Manufacturing precision
If individual chip processing is used, then the bonding precision can be maintained, but the press bonding cycle time is extended
Solution Approach 1:
Multiple bonding modules operate continuously and simultaneously, eliminating idle time between individual bonding operations. While one module is performing alignment, another is pressing, and a third is preparing for the next chip. This continuous parallel operation maintains high bonding accuracy for each chip while dramatically reducing the overall cycle time through uninterrupted multi-channel processing.
Solution Approach 2:
The bonding process is segmented into multiple independent modules that can operate in parallel. Each module handles one chip independently, maintaining the precision of individual processing. Simultaneously, the segmentation allows multiple modules to work concurrently, reducing the total cycle time by performing multiple bonding operations at the same time rather than sequentially.
4Productivity
If batch processing is implemented, then productivity is increased, but the control complexity increases
Solution Approach 1:
The control device is designed as a universal multi-functional system that can control multiple bonding modules through standardized interfaces. The same control logic and algorithms are applied across all modules, making the control system scalable. This universal control approach handles batch processing of multiple chips while avoiding the need for separate complex control systems for each module, thus managing control complexity effectively.
Data Source
AI summary
A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.