Real-Time Parallelism Correction in Chip Bonding Apparatus
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Solution Overview
Problem
Existing chip bonding technologies face challenges in accurately measuring and correcting the parallelism between the bonding head and stage in real-time during the bonding process, leading to increased failures and extended bonding times.
Innovation Solution
A bonding apparatus equipped with a detecting unit to assess the parallelism between the bonding head and stage, and a correcting unit to adjust either the bonding head or stage in real-time, ensuring accurate alignment through sensors and encoders, allowing for continuous operation without stopping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pressure sensitive paper is used to detect parallelism between bonding head and stage, then the detection method is simple, but the measurement accuracy is insufficient and bonding failures increase
Solution Approach 1:
The patent replaces the mechanical pressure sensitive paper detection method with an optical detection system using a camera and image processing. The camera captures images of the bonding interface, and software algorithms analyze the images to determine parallelism with high precision, eliminating the inaccuracies of mechanical paper-based methods.
Solution Approach 2:
The patent introduces a specialized detection structure consisting of a detection plate with multiple detection points and a camera system as an intermediary between the bonding head and stage. This intermediary system provides accurate real-time feedback on parallelism without interfering with the bonding process, enabling precise measurement that directly reduces bonding failures.
2Productivity
If parallelism verification is performed after bonding process, then the bonding process can proceed without interruption, but bonding time increases and failures increase
Solution Approach 1:
The patent implements continuous real-time detection of parallelism during the bonding process through the camera system and image processing algorithms. The detection occurs continuously without interrupting the bonding operation, allowing immediate identification and correction of parallelism issues while maintaining productive workflow.
Solution Approach 2:
The patent establishes a real-time feedback loop where the camera system continuously monitors parallelism, the system processes the images to determine deviations, and correction mechanisms adjust the bonding head or stage position accordingly during the bonding process. This closed-loop feedback ensures high reliability without sacrificing productivity.
3Reliability
If real-time detection and correction system is implemented, then bonding failures decrease and efficiency improves, but device complexity increases
Solution Approach 1:
The patent designs the detection system with multi-functionality: the same camera system and image processing platform serve multiple purposes including parallelism detection, bonding quality assessment, and alignment verification. This universal approach reduces overall system complexity compared to having separate specialized systems for each function.
Solution Approach 2:
The system incorporates automated image processing algorithms that automatically analyze captured images, calculate parallelism deviations, and generate correction commands without requiring manual intervention. The system self-corrects by automatically adjusting bonding head or stage positions based on detected deviations, reducing operational complexity.
Data Source
AI summary
A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.