Semiconductor Chip Bonding Pedestal Temperature Control
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Solution Overview
Problem
Existing devices for conditioning semiconductor chips face challenges with high throughput testing due to time-consuming loading and unloading processes and condensation issues, which impede efficient temperature control and testing.
Innovation Solution
A device with a base body that can be flushed with fluid for temperature control, featuring recesses for chip bonding pedestals and a motherboard for electrical connection, allowing for efficient thermal and electrical management, and a handling system for simultaneous chip loading and unloading to prevent condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor chip is placed on a bonding pedestal and cooled/heated in a climatic test chamber, then temperature control is achieved, but loading and unloading the chamber becomes time-consuming and condensation problems occur
Solution Approach 1:
The device divides the temperature control function into two separate components: a climatic test chamber for environmental testing and a separate bonding pedestal with integrated temperature control for chip mounting and testing. This segmentation allows the bonding pedestal to be quickly exchanged between chambers without moving the entire chamber, reducing loading/unloading time while maintaining temperature control capability.
Solution Approach 2:
The bonding pedestal acts as an intermediary component that interfaces between the climatic test chamber and the semiconductor chip. It provides a mounted platform with integrated temperature control, allowing chips to be tested at controlled temperatures without requiring the entire chamber to be loaded and unloaded repeatedly, thus reducing time loss.
2Measurement precision
If temperature control is applied to semiconductor chips, then testing accuracy is improved, but condensation of moisture or ice forms on the chip surface
Solution Approach 1:
The device controls the temperature parameter of the bonding pedestal to maintain it above the dew point of the surrounding environment. By keeping the chip mounting surface at a temperature that prevents moisture condensation (typically above 0°C or above the dew point), the system achieves accurate temperature-controlled testing while preventing harmful condensation or ice formation on the chip surface.
3Reliability
If traditional conditioning methods are used, then single chip testing is possible, but high throughput testing of multiple chips cannot be achieved
Solution Approach 1:
The bonding pedestal is designed with a universal mounting structure that can accommodate multiple semiconductor chips simultaneously. The temperature control system can be applied to multiple chips at once, enabling high-throughput testing of several chips in parallel while maintaining reliable temperature control for each chip, thus improving both productivity and testing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high throughput testing with improved reliability by ensuring effective temperature control and preventing condensation, facilitating efficient and flexible testing of semiconductor chips.
Implementation Method 1
a base body which can be flushed with a fluid for temperature control
Implementation Method 2
A chip bonding pedestal is respectively inserted into the recess or recesses of the base body, is in thermal contact with the base body
Data Source
AI summary
The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.