Chip Bonding Auxiliary Pattern for Non-Destructive Strength Estimation
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Solution Overview
Problem
Existing methods for measuring the bonding strength of semiconductor chips are destructive and prone to measurement errors due to human operation factors, which can lead to device failure and increased manufacturing costs.
Innovation Solution
A method involving the formation of an auxiliary pattern on one chip's surface, allowing for the creation of gap spaces when bonded with another chip. The dimensions of the pattern and gap spaces are measured non-destructively using techniques like ultrasonic or optical measurements to estimate bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the plug blade terminal strength method is used to measure bonding strength, then the measurement can be performed with relatively simple instruments and equipment, but the method is destructive and requires operation of trained staff which leads to measurement errors
Solution Approach 1:
The patent replaces the mechanical blade insertion method with an acoustic wave-based measurement system. Ultrasonic waves are transmitted through the chip stack, and the bonding strength is determined by analyzing acoustic impedance changes and wave transmission characteristics, eliminating the need for mechanical cutting and human operation while improving measurement reliability
Solution Approach 2:
The patent introduces acoustic waves as an intermediary to measure bonding strength indirectly. Instead of directly cutting and measuring the bond interface, ultrasonic waves serve as a mediator to probe the bonding quality through acoustic impedance variations, enabling non-destructive measurement with high precision
2Ease of manufacture
If the plug blade terminal strength method is used, then the measurement process can be performed with simple equipment, but it causes device damage and increases manufacturing costs
Solution Approach 1:
The patent replaces destructive mechanical cutting with non-destructive acoustic wave transmission. Ultrasonic waves pass through the chip stack without causing physical damage, allowing the chips to remain functional after measurement and eliminating the need to discard tested chips, thereby reducing manufacturing costs
Solution Approach 2:
The measurement system uses the chip stack itself as the transmission medium for acoustic waves. The chip structure serves its dual purpose of being both the device under test and the waveguide for ultrasonic measurement, eliminating the need for separate test structures or sacrificial components
3Ease of operation
If blade insertion is used to measure bonding strength, then the measurement can be performed operationally, but the brittle nature of semiconductor chips requires trained staff and introduces human operation factors that cause measurement variation
Solution Approach 1:
The patent replaces manual blade insertion operations with an automated acoustic measurement system. Ultrasonic transducers automatically transmit and receive waves, and signal processing algorithms automatically analyze the results, eliminating human operation variability and achieving consistent, repeatable measurements without requiring trained staff
Solution Approach 2:
The measurement system incorporates feedback through acoustic signal analysis. The transmitted ultrasonic waves are received and analyzed to provide real-time information about bonding quality, allowing for automated decision-making and consistent measurement results that are independent of operator skill level
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs by avoiding destructive testing and minimizes measurement errors caused by human factors, resulting in improved accuracy and reliability of bonding strength estimation.
Implementation Method 1
The dimensions of the auxiliary pattern and the gap space can be measured by a non-destructive measurement methods (for example, an ultrasonic measurement, an optical measurement, or other suitable methods/techniques)
Implementation Method 2
The dimensions of the auxiliary pattern and the gap space can be measured by a non-destructive measurement methods (for example, an ultrasonic measurement, an optical measurement, or other suitable methods/techniques)
Implementation Method 3
two semiconductor chips (for example, wafers) are cleaned and bonded together, and then subjected to a high temperature annealing treatment to form a chemical bond connection at the interface of these two semiconductor chips
Implementation Method 4
two semiconductor chips (for example, wafers) are cleaned and bonded together, and then subjected to a high temperature annealing treatment to form a chemical bond connection
Data Source
AI summary
A chips bonding auxiliary structure includes a first chip, an auxiliary pattern and a second chip. The first chip has a first surface. The auxiliary pattern is form on the first surface. The second chip has a second surface bonding to the first surface to form at least one gap space surrounding the auxiliary pattern.