Chip Bonding Surface Inspection Before Hybrid Bonding

The patent applies preliminary action by performing quality determination at multiple stages: first on the semiconductor wafer before peeling, and then again on the separated chip immediately before bonding. This two-stage preliminary determination ensures that chips are screened for defects both while still on the wafer and again after separation, capturing contamination that occurs during conveyance and peeling operations.

The patent implements feedback by using imaging devices to capture chip states at different stages and feeding this information back to the control unit. The control unit compares the chip state before peeling with the state after peeling, identifying changes that indicate contamination or defects introduced during conveyance, and uses this feedback to prevent bonding of defective chips.

The patent replaces mechanical foreign particle removal methods with an optical detection system. Instead of using mechanical cleaning or filtration, the system uses imaging devices to detect foreign particles on the chip bonding surface and control unit logic to identify and reject contaminated chips, substituting mechanical action with optical-field-based detection and control.

The patent introduces an intermediary detection and control system between the chip and bonding process. The imaging device acts as an intermediary to detect foreign particles, and the control unit serves as an intermediary to process this information and make bonding decisions, creating a buffer that allows adhesive bonding simplicity while maintaining hybrid bonding-level quality control through intelligent selection of chips to bond.