Chip Bonding Heating Sequence for Lower Thermal Stress
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Solution Overview
Problem
Existing chip bonding devices and methods face inefficiencies in the heating process, leading to residual thermal stress and suboptimal bonding results.
Innovation Solution
A chip transferring and bonding device and method that incorporate a signal control module, a substrate carrying module, a chip transferring module, a substrate preheating module, and a chip bonding module, allowing for simultaneous preheating and instantaneous heating of soldering materials between chips and a circuit substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heating method is used to bond chips to circuit board, then bonding process can be completed, but residual thermal stress remains and bonding results are suboptimal
Solution Approach 1:
The patent applies preliminary action by preheating the entire circuit board substrate before localized bonding heating. The preheating module heats the substrate to a predetermined temperature in advance, which reduces thermal shock and residual stress during the subsequent bonding process. This preliminary thermal preparation improves bonding reliability while minimizing harmful thermal effects.
Solution Approach 2:
The heating function is segmented into two independent modules: a preheating module for overall substrate heating and a bonding module for localized chip bonding heating. This segmentation allows each module to perform its specific function optimally - the preheating module reduces thermal stress while the bonding module provides the necessary bonding temperature, resolving the contradiction between bonding strength and thermal stress.
2Productivity
If conventional sequential heating process is used, then heating control can be achieved, but processing time is extended and efficiency is reduced
Solution Approach 1:
The preheating module performs preliminary heating of the substrate in advance before the bonding process. By preparing the substrate temperature beforehand, the subsequent bonding operation can proceed more quickly and efficiently, reducing the overall processing time while maintaining quality control.
Solution Approach 2:
The patent enables continuous useful action by having the preheating module operate simultaneously with chip placement and bonding preparation. The substrate is continuously heated while other operations occur, eliminating idle time and improving overall processing efficiency without extending the heating duration.
3Object-affected harmful factors
If uniform heating is applied to the entire substrate, then thermal stress is reduced, but energy consumption increases and heating precision decreases
Solution Approach 1:
The heating system is segmented into a preheating module for uniform substrate heating and a bonding module for localized heating. The preheating module uses lower energy to uniformly heat the entire substrate, reducing thermal stress. The bonding module then uses higher energy only at the specific bonding location, achieving precision without excessive overall energy consumption.
Solution Approach 2:
The patent applies local quality by providing different heating characteristics to different regions: the preheating module provides uniform low-temperature heating across the entire substrate to reduce thermal stress, while the bonding module provides localized high-temperature heating only at the chip bonding positions, optimizing energy efficiency and precision.
4Manufacturing precision
If separate preheating and bonding processes are used, then temperature control can be achieved, but processing complexity increases
Solution Approach 1:
The patent merges the preheating and bonding processes into a single integrated device with coordinated modules. The preheating module and bonding module work together in a unified system controlled by a single controller, which coordinates the heating sequences and temperatures. This integration maintains precise temperature control while reducing process complexity compared to completely separate systems.
Solution Approach 2:
The integrated device performs multiple functions through its modules: the preheating module handles overall substrate temperature control, while the bonding module handles localized bonding temperature control. Both modules share the same control system and work together to achieve precise temperature management throughout the process, maintaining manufacturing precision without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables instantaneous and direct heating of the circuit substrate and soldering materials from a preheating temperature to a bonding temperature, reducing residual thermal stress and enhancing bonding strength.
Implementation Method 1
preheating the circuit substrate at a predetermined preheating temperature... allowing a plurality of soldering materials disposed between each of the chips and the circuit substrate to be preheated
Implementation Method 2
instantaneously heating the soldering materials disposed between each of the chips and the circuit substrate at a predetermined bonding temperature
Data Source
AI summary
A chip transferring and bonding device, and a chip transferring and bonding method are provided. The chip transferring and bonding device includes a signal control module, a substrate carrying module, a chip transferring module, a substrate preheating module and a chip bonding module. The substrate preheating module is configured to preheat the circuit substrate at a predetermined preheating temperature, thereby allowing the soldering materials disposed between each chip and the circuit substrate to be preheated at the predetermined preheating temperature. The chip bonding module is configured to instantaneously heat the soldering materials disposed between each chip and the circuit substrate at a predetermined heating temperature. When the substrate preheating module and the chip bonding module are optionally configured to be used simultaneously, the substrate preheating module is configured to provide a predetermined preheating temperature, and the chip bonding module is configured to provide a predetermined heating temperature.