Chip Bonding Tool Fixing Unit for Stress Relief
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Solution Overview
Problem
Conventional chip bonding apparatuses face issues with bonding tool deformation or breakage and accidental falling-off due to direct connection to the heater, leading to stress and potential failures during the chip bonding process.
Innovation Solution
A chip bonding apparatus design that includes a bonding tool assembly fixing unit with electrostatic attachment or a notch gripper mechanism, allowing the bonding tool to be securely attached and detached, minimizing physical stress and preventing accidental detachment during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding tool is directly connected to the heater, then the bonding tool can be heated and pressed to bond the chip to the substrate, but stress is transferred to the bonding tool causing deformation or breakage
Solution Approach 1:
The bonding tool assembly is divided into separate components: the bonding tool itself, the bonding tool fixing unit, and the heater. This segmentation isolates the bonding tool from direct stress transfer to the heater, preventing deformation and breakage while maintaining heating functionality.
Solution Approach 2:
The bonding tool fixing unit acts as an intermediary component between the heater and the bonding tool. It provides a secure attachment mechanism that prevents direct stress transfer, thereby protecting the bonding tool from deformation and breakage during the bonding process.
2Ease of operation
If the bonding tool is directly connected to the heater, then the bonding process can be performed, but the bonding tool may fall off when the connection is weak
Solution Approach 1:
The bonding tool fixing unit employs a dynamic attachment mechanism that can securely hold the bonding tool during operation and allow for easy replacement when needed. This ensures both operational ease and attachment stability throughout the bonding process.
Solution Approach 2:
The bonding tool fixing unit serves as an intermediary that provides a secure connection between the heater and bonding tool, preventing accidental detachment while maintaining ease of operation during the bonding process.
3Reliability
If the bonding tool is securely attached to prevent falling off, then reliability improves, but the device complexity increases
Solution Approach 1:
The bonding tool assembly is segmented into modular components (bonding tool, fixing unit, heater) that can independently function. This segmentation achieves secure attachment without requiring a complex integrated structure, as each component performs its specific function.
Solution Approach 2:
The bonding tool fixing unit is designed as a simple intermediary component that provides secure attachment through a straightforward mechanism, avoiding the need for complex structural designs while maintaining high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively minimizes deformation and breakage of the bonding tool, ensuring stable operation and preventing accidents like tool falling-off, thus enhancing the reliability of the chip bonding process.
Implementation Method 1
The third portion of the first bonding tool fixing unit may be configured to attach to the first portion of the bonding tool assembly fixing unit by an electrostatic force.
Data Source
AI summary
Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.