Semiconductor Chip Cage Structure for Warpage-Stable Packaging
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Solution Overview
Problem
The alignment of semiconductor chips with substrates is compromised by differences in coefficient of thermal expansion (CTE) and chip size, leading to inaccurate contact due to warpage and chip sliding, which affects the operability and stability of the packaging process.
Innovation Solution
The use of a cage structure with a cavity to constrain the semiconductor chip, combined with a redistribution layer (RDL) and package body, enhances positioning accuracy by restricting chip displacement and warpage, and includes materials and processes like adaptive patterning and fine-line/space capabilities to improve yield and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the chip size is increased, then the packaging capacity is improved, but the warpage of the substrate increases leading to inaccurate contact
Solution Approach 1:
A cage structure is introduced as an intermediary component between the substrate and the chip. The cage has a cavity that physically constrains the chip, preventing warpage-induced misalignment and maintaining accurate contact between the chip and substrate despite larger chip dimensions.
Solution Approach 2:
The patent changes the physical state and positioning parameters of the chip by enclosing it within the cage structure. This constraint mechanism alters how the chip responds to thermal expansion and mechanical stress, maintaining positional stability throughout the packaging process.
2Reliability
If the CTE difference between chip and substrate is considered, then the thermal expansion mismatch is acknowledged, but chip shift and sliding occur leading to inaccurate contact
Solution Approach 1:
The cage structure serves as a mediator that decouples the thermal expansion behaviors of the chip and substrate. By physically constraining the chip within its cavity, the cage prevents relative displacement caused by CTE differences, allowing each component to expand independently without compromising alignment.
3Ease of manufacture
If conventional packaging methods are used, then the process is simple, but chip sliding and warpage result in inaccurate contact and reduced yield
Solution Approach 1:
The cage structure is integrated into the packaging process as a yield-enhancing intermediary. While it adds a structural element, the cage prevents defective alignments and sliding, thereby increasing the overall yield of functional packages without requiring complex process changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the positioning accuracy of semiconductor devices, ensuring accurate contact and improving the yield and output of wafer-level and panel-level packaging processes by minimizing warpage and chip sliding.
Implementation Method 1
The cage has a first cage surface, a second cage surface opposite to the first cage surface and a cavity extending towards the second cage surface from the first cage surface. The semiconductor chip is disposed in the cavity.
Implementation Method 2
The package body covers the semiconductor chip.
Implementation Method 3
The first RDL (redistribution layer) is disposed over the package body and the semiconductor chip.
Data Source
AI summary
A semiconductor device includes a cage, a semiconductor chip, a package body and a first RDL (redistribution layer). The cage has a first cage surface, a second cage surface opposite to the first cage surface and a cavity extending towards the second cage surface from the first cage surface. The semiconductor chip is disposed in the cavity. The package body covers the semiconductor chip. The first RDL is disposed over the package body and the semiconductor chip.