Automated Optical Inspection of Adhesive Bonds in Chip Cards
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Solution Overview
Problem
Ensuring the integrity of the adhesive connection between an electronic circuit and a card body in chip cards, which is crucial for maintaining electrical connectivity and preventing defects that could render the chip card unusable.
Innovation Solution
An inspection device comprising an illumination source, an image camera, and a processor that captures images of the card body, traces the adhesive layer along the electronic circuit's contour, and verifies the adhesive connection by detecting a closed path, allowing for efficient automated quality assessment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If traditional inspection methods are used to verify adhesive connections, then manual inspection can identify defects, but the inspection process is time-consuming and lacks automation
Solution Approach 1:
The patent replaces manual mechanical inspection with an automated optical inspection system consisting of an illumination source, image camera, and processor. The system captures images of the adhesive layer and automatically analyzes them to detect defects, eliminating the need for time-consuming manual inspection while maintaining inspection quality.
Solution Approach 2:
The patent creates an optical copy (image) of the adhesive connection for inspection purposes. By capturing an image of the actual adhesive layer and analyzing it digitally, the system enables automated defect detection without physically disturbing the connection, significantly reducing inspection time compared to manual methods.
2Reliability
If the adhesive layer is inspected to ensure complete coverage along the electronic circuit contour, then connection reliability improves, but the inspection complexity increases
Solution Approach 1:
The patent replaces complex manual visual inspection with an automated image processing system. The processor automatically analyzes the captured image to verify adhesive coverage along the electronic circuit contour, providing reliable defect detection without requiring complex manual evaluation procedures.
Solution Approach 2:
The patent introduces an image camera as an intermediary between the adhesive connection and the inspection process. By capturing an optical image of the adhesive layer, the system creates an intermediate representation that can be easily analyzed by the processor to verify coverage and detect defects, simplifying the overall inspection approach.
3Measurement precision
If high-resolution imaging is used to detect defects in the adhesive layer, then measurement precision improves, but the illumination requirements become more stringent
Solution Approach 1:
The patent applies local quality by using targeted illumination specifically directed at the adhesive layer area of interest. The illumination source is positioned and configured to provide optimal lighting conditions for the specific inspection region, ensuring sufficient contrast and detail for defect detection without requiring excessive overall illumination intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides a reliable method for verifying the adhesive connection, ensuring the electrical integrity and usability of chip cards by efficiently detecting defects in the adhesive layer.
Implementation Method 1
an illumination source (105) which is designed to illuminate the card body (103)
Implementation Method 2
an image camera (107) which is designed to capture an image recording of the illuminated card body (103) with the electronic circuit (101)
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The invention relates to an inspection device (100) for verifying an adhesive bond formed by an adhesive layer (102) between an electronic circuit (101) and a card body (103). The inspection device (100) comprises a light source (105) configured to illuminate the card body (103), an image camera (107) configured to capture an image of the illuminated card body (103) with the electronic circuit (101), and a processor (109) configured to detect the path of the adhesive layer (102) along a contour of the electronic circuit (101) in the captured image and to verify the adhesive bond based on the detected path of the adhesive layer (102).