Chip Card Module Adhesive Layer That Breaks Reuse Connections

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Solution Overview

Problem

Existing electronic modules in dual chip cards can be easily lifted and reused for fraudulent purposes without damaging the module, allowing unauthorized data access.

Innovation Solution

Incorporating an adhesive security layer with lower bond strength than the holding layer, ensuring that the connections break upon attempted separation, making it difficult to reuse the module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the electronic module uses a strong adhesive holding layer to secure the module in the card, then the module is firmly held in place, but the module can be easily lifted and reused for fraudulent purposes without damaging the module

Engineering Contradiction:

Improvebond strength of holding layerVSAvoidsecurity against fraudulent reuse

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent applies different adhesive properties to different layers: the holding layer uses strong adhesive for firm attachment, while the security layer uses weak adhesive that breaks first during lifting attempts. This local differentiation of adhesive strength resolves the contradiction by ensuring both firm holding and security against reuse simultaneously

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The adhesive system is segmented into two distinct layers with different functions: a holding layer for secure attachment and a security layer for fraud prevention. This segmentation allows each layer to optimize its adhesive strength independently, resolving the contradiction between strong holding and security

Inventive Principle:

Principle #1Segmentation

2Reliability

If the electronic module uses a weak adhesive security layer to prevent lifting, then the module cannot be easily removed, but the module cannot be firmly held in place

Engineering Contradiction:

Improvesecurity against fraudulent reuseVSAvoidbond strength of holding layer

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The security layer uses weak adhesive specifically at the critical interface between support layer and substrate, while the holding layer maintains strong adhesive for overall secure attachment. This local quality differentiation resolves the contradiction by applying weak adhesive only where needed for security without compromising overall holding strength

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The security layer acts as an intermediary between the holding layer and the module components, designed to fail first and protect the valuable electronic components. This intermediary layer with controlled weak adhesion resolves the contradiction by sacrificing itself to prevent fraudulent reuse while allowing strong holding elsewhere

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the adhesive security layer has high bond strength, then the connections remain intact during separation, but the module can be lifted and reused for fraudulent purposes

Engineering Contradiction:

Improvebond strength of security layerVSAvoidfraudulent data access

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent converts the potential harm of module removal into a beneficial security feature by designing the security layer to break during lifting attempts, destroying the connections and rendering the module unusable. This transforms the removal action from a fraudulent opportunity into a security enforcement mechanism

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The weak security layer pre-establishes a failure mechanism that activates before fraudulent reuse can occur. By designing the adhesive to break at controlled strength levels, the system preliminarily prevents fraudulent access by destroying connections before they can be exploited

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents unauthorized reuse by damaging connections during separation, requiring resin cleaning to recover data, thus deterring fraudulent use.

Implementation Method 1

The electronic module comprises at least one security holding layer arranged between the first support layer and the substrate, said security layer being an adhesive layer, said security layer having technical characteristics such that the bond strengths Fad1 of this layer are lower than the bond strengths Fad2 of the holding means

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS12512420B2Electronic module for chip card

Publication Date: 2025.12.30 SMART PACKAGING SOLUTIONS SPS

AI summary

The invention relates to an electronic module (30) intended to be held in place on a carrier (1) by a holding means (4), the electronic module (30) consisting of a plurality of layers, comprising a first carrier layer (10) carrying one or more contacts (11), a first face (10b) of the carrier layer (10) is in contact with a first face (12a; 53a) of a substrate (12; 53) and comprising a face of the substrate (12b; 53b) carrying one or more antennas (13; 50, 51), the antenna(s) (13; 50, 51) being connected to an integrated circuit (14) via feeder links (15). The electronic module (30) comprises at least one stay-in-place safety layer (31) arranged between the first carrier layer (10) and the substrate (12), the safety layer (31) being an adhesive layer, the safety layer (31) having technical features such that the binding forces Fad1 of the layer are lower than the binding forces Fad2 of the holding means (4) so as to cause the rupture of the feeder links (15) by the action of a tensile force exerted on the electronic module.