Chip Card Antenna Support Connection Unit Fabrication
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Solution Overview
Problem
The existing manufacturing processes for dual-interface smart cards are complex, impacting productivity and reliability due to the separate production and connection of electronic modules and antennas, which complicates the connection between the two components.
Innovation Solution
A method involving a connection unit with conductive tracks that connects the antenna and module independently, using a reel-to-reel process, and solder material with a melting temperature between 120°C and 230°C, allowing for a reliable and simplified connection between the antenna and module, compatible with various formats and types of antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate manufacturing processes are used for electronic modules and antennas, then manufacturing flexibility is maintained, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines the electronic module and antenna into a single integrated structure where the antenna is formed directly on the module substrate. This integration eliminates the need for separate manufacturing processes and subsequent assembly steps, thereby reducing manufacturing complexity while maintaining the flexibility to design different antenna patterns and module configurations.
Solution Approach 2:
The module substrate serves multiple functions: it acts as both the mechanical support for the electronic circuit and the substrate for forming the antenna conductive tracks. This multi-functionality reduces the number of separate components and assembly steps, addressing the manufacturing complexity issue while preserving design versatility.
2Reliability
If complex connection processes are used to connect antenna and module, then connection reliability can be maintained, but productivity decreases
Solution Approach 1:
By integrating the antenna directly onto the module substrate, the patent eliminates the connection step between separate antenna and module components. This merger ensures inherent connection reliability while dramatically improving productivity by removing a complex assembly process from the manufacturing flow.
Solution Approach 2:
The antenna conductive tracks are formed on the module substrate during the same manufacturing process used to create the electronic circuit patterns. This preliminary action ensures that the antenna and module are permanently connected from the outset, eliminating subsequent connection steps and ensuring reliability without compromising productivity.
3Device complexity
If integrated antenna-module structure is used, then manufacturing complexity is reduced, but adaptability to different antenna formats is limited
Solution Approach 1:
The patent employs different conductive track formation methods for different regions of the module substrate. Etching is used in areas requiring precise geometric control, while screen printing or deposition is used where different patterns are needed. This local differentiation allows the integrated structure to support multiple antenna formats (ID-1, 1/2 ID-1, etc.) while maintaining manufacturing simplicity.
Solution Approach 2:
The invention changes the parameters of the conductive track formation process to accommodate different antenna formats. By adjusting track width, spacing, and pattern geometry within the same integrated manufacturing process, the system can produce various antenna types without requiring fundamentally different manufacturing approaches, thus maintaining both simplicity and adaptability.
4Strength
If conventional connection methods are used between antenna and module, then connection strength can be ensured, but manufacturing time increases
Solution Approach 1:
The integration of antenna and module into a single structure eliminates the need for separate connection operations. The conductive tracks are formed as part of the substrate fabrication process, ensuring inherent mechanical and electrical connection strength while reducing manufacturing time by removing multiple assembly steps.
Solution Approach 2:
The antenna conductive patterns are created during the initial substrate processing stages, before the module components are assembled. This preliminary formation of connection paths ensures that no additional time is required for subsequent connection operations, while the permanent integration maintains strong mechanical and electrical bonds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the connection process, enhances reliability, and reduces manufacturing complexity, enabling continuous production and improved assembly efficiency for dual-interface smart cards.
Implementation Method 1
solder material with a melting temperature between 120°C and 230°C
Data Source
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AI summary
The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module (400) are provided. This chip card module (400) comprises a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit (300) is used to establish a connection between the antenna and conducting tracks of the module (400). The invention also relates to a method for fabricating an antenna support comprising such a connection unit (300). The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.