Double Interface Chip Card Module Antenna Contact Layout

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Solution Overview

Problem

Existing dual interface smart cards face manufacturing inefficiencies and reliability issues due to complex mechanical and electrical connections between the antenna and microelectronic module, leading to reduced communication performance and shorter lifespan.

Innovation Solution

The electronic module integrates the antenna directly on the microelectronic chip, with electrical contacts positioned to avoid electromagnetic interference, allowing for improved contactless communication and reliable bonding without additional electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the antenna is integrated directly on the microelectronic module, then manufacturing efficiency and reliability are improved, but electromagnetic interference between the electrical contacts and antenna occurs, degrading contactless communication performance

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidelectromagnetic interference
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The module is divided into distinct functional zones: a first zone for contactless communication antenna and a second zone for contact electrical terminals. This spatial segmentation prevents electromagnetic interference between the antenna and metallic contacts while maintaining integration on the same substrate, thereby resolving the contradiction between manufacturing efficiency and communication performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are assigned different electromagnetic properties: the first zone contains the antenna with specific electromagnetic characteristics for contactless communication, while the second zone contains metallic contacts for contact mode. This local differentiation allows both functions to coexist without mutual interference, improving both manufacturing reliability and communication performance.

Inventive Principle:
Principle #3Local quality

2Length of stationary object

If the antenna is made in the card body rather than on the module, then communication range is improved, but mechanical and electrical connection reliability deteriorates

Engineering Contradiction:
Improvecommunication rangeVSAvoidconnection reliability
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The antenna is merged with the microelectronic module substrate, creating an integrated structure where the antenna terminals are directly connected to the chip terminals. This merging eliminates the need for separate mechanical connections between the antenna and module, thereby improving connection reliability while maintaining adequate communication range through the integrated design.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If electrical contacts are positioned directly opposite the antenna on the module, then space utilization is improved, but contactless communication capacity is degraded due to electromagnetic disturbance

Engineering Contradiction:
Improvespace utilizationVSAvoidelectromagnetic disturbance
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The module surface is segmented into a first zone for the antenna and a second zone for electrical terminals, with these zones positioned at opposite sides of the module. This segmentation allows efficient space utilization while preventing electromagnetic disturbance between the antenna and contacts, as the metallic contacts are positioned away from the antenna's electromagnetic field region.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances manufacturing efficiency, reliability, and communication range, ensuring a longer lifespan of up to ten years with improved contactless performance and reduced electromagnetic interference.

Implementation Method 1

an antenna formed of at least one turn, and whose terminals are connected to the terminals of a microelectronic chip

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Implementation Method 2

a substrate provided with an electrical contact terminal block allowing operation by contact with the contacts of a reader

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP1932104B1Double interface communication electronic module, in particular for a chip card
Publication Date: 2012.11.07 SMART PACKAGING SOLUTIONS SPS
  • EP1932104B1 patent drawingFigure 1A~1B
  • EP1932104B1 patent drawingFigure 2~3
  • EP1932104B1 patent drawingFigure 4~5

AI summary

The invention relates to a double interface communication electronic module (11), in particular for a chip card, comprising a substrate (27) provided with an electric contact terminal (17) which makes it possible to operationally contacting the reading device contacts, is provided with an antenna which has at least one spire (13) and whose terminals are connected to the terminals of an electronic chip positioned on the module (11) face. Said module is characterised in that the antenna spires (13) are arranged substantially outside the area covered with electric contacts (17) in such a way that said electric contacts of the terminal are unable to form an electromagnetic armour to signals receivable by the antenna. Said invention is particularly suitable for producing double interface communication contact and contactless chip cards.