Dual-Interface Chip Card Module With Segmented Antenna Substrate
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Solution Overview
Problem
Existing electronic modules for chip cards are costly due to the use of expensive substrates and lack flexibility in antenna design.
Innovation Solution
A novel manufacturing process combining a single-sided film with electrically conductive regions and a substrate, incorporating an integrated circuit and antenna, secured together with a protective layer, to reduce costs and enhance design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive substrates are used for electronic modules, then manufacturing reliability is improved, but manufacturing cost increases
Solution Approach 1:
The electronic module is divided into separate components: a flexible printed circuit board with contact plates and a separate substrate with antenna and contactless communication elements. These segments are assembled together rather than requiring a single expensive substrate, reducing overall manufacturing cost while maintaining reliability
Solution Approach 2:
The module uses composite construction combining flexible printed circuit board materials with separate substrate materials (such as aluminum for antenna, epoxy glass, polyethylene naphthalate, or polyvinyl chloride). This composite approach allows optimization of each component for its specific function rather than requiring an expensive multi-functional substrate
2Reliability
If complex antenna designs are implemented, then contactless communication performance is improved, but device complexity increases
Solution Approach 1:
The antenna system is segmented from the main circuit board and implemented as separate electrically conductive regions on a dedicated substrate. This segmentation allows independent optimization of antenna geometry and pattern without complicating the overall module design, as the antenna can be designed and tuned separately
Solution Approach 2:
The substrate contains localized electrically conductive regions (such as aluminum areas) specifically positioned for antenna function, while other regions of the module maintain different properties for contactless communication. This local differentiation allows complex antenna patterns without requiring the entire device structure to be complex
3Adaptability or versatility
If dual-interface functionality (contact and contactless) is integrated, then versatility is improved, but manufacturing complexity increases
Solution Approach 1:
The contact interface (via flexible printed circuit board with contact plates) and contactless interface (via substrate with antenna) are merged into a single integrated module assembly. Both interfaces share common elements such as the integrated circuit and protective layer, allowing dual functionality without requiring separate manufacturing processes for each interface type
Solution Approach 2:
The flexible printed circuit board substrate serves multiple functions: it provides mechanical support, carries contact plates for contact interface, and can be configured with electrically conductive regions for contactless communication. This multi-functional design reduces overall manufacturing complexity compared to using separate components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process decreases manufacturing costs and offers flexibility in antenna design while ensuring contact and contactless functions, using materials like aluminum and dielectrics such as epoxy glass, polyethylene naphthalate, and polyvinyl chloride.
Implementation Method 1
an antenna is integrated into the module and allows electromagnetic coupling with a 'booster' antenna incorporated into the rigid support of the card
Data Source
AI summary
A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps:Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures,Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object,Securing said single-sided film and said substrate together,Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions,Depositing a protective layer incorporating at least said integrated circuit.Also provided is a module obtained by means of the process.