Chip Card Module With Embedded IC Cavity
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Solution Overview
Problem
The integration of additional components and functional layers in microcircuit cards poses a challenge due to the limited thickness available in standard card bodies, requiring modifications to accommodate thicker elements like batteries or displays without exceeding standardized dimensions, and existing embedding techniques are not suitable for off-center inserts.
Innovation Solution
The integrated circuit is housed within the module's thickness, allowing for a reduced cavity depth in the card body, with the cavity depth corresponding to or exceeding the integrated circuit's thickness, and connection wires or flip-chip mounting ensure electrical connectivity, enabling the encapsulation of thicker components and functional layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components (battery, display) are integrated into the card body, then the card functionality is extended, but the card thickness exceeds standardized dimensions
Solution Approach 1:
The patent relocates the integrated circuit from the traditional planar position on the card surface to a vertical position within the card thickness dimension. By creating a cavity in the card body and embedding the IC vertically, the design utilizes the third dimension (depth) to accommodate additional components while maintaining the card's external dimensions within standardized limits.
2Adaptability or versatility
If the integrated circuit is positioned off-center to accommodate thicker components, then component integration is enabled, but existing embedding techniques are no longer suitable
Solution Approach 1:
The patent divides the card body into distinct functional zones: a cavity region for housing the integrated circuit and additional components, and a surrounding structural region. This segmentation allows the embedding process to be optimized for each zone independently, with the cavity specifically designed to accommodate off-center positioning of the IC and associated components like batteries and displays.
Solution Approach 2:
The patent introduces a cavity as an intermediary structure between the card body and the integrated circuit. This cavity serves as a dedicated housing that facilitates the embedding of the IC and additional components, providing mechanical support and electrical connection pathways while enabling off-center positioning that would not be possible with traditional flat embedding techniques.
3Length of stationary object
If the cavity depth is reduced to maintain standard card thickness, then compliance with standards is maintained, but space for additional components is limited
Solution Approach 1:
The patent implements a nested structure where the integrated circuit is housed within a cavity that is itself embedded in the card body. Additional components such as batteries and display elements are nested within the same cavity or adjacent cavities, allowing multiple components to share the vertical space efficiently. This nesting approach maximizes the use of available volume within the constrained card thickness.
Data Source
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AI summary
The module (M) has outer connecting pads (30) arranged on an upper face of a support, and inner connecting pads (40) arranged on a lower surface of the support. An integrated circuit (200) is housed in a layer of the support, and is housed in an open cavity on the lower face of the support. The inner connecting pads are arranged on a periphery of the cavity, where the support is realized in a single piece. The support is formed of an upper support and a lower support assembled with one another. Independent claims are also included for the following: (1) a chip card including a card body having shape adapted for receiving a module and including an intermediate functional layer that is a metallic layer (2) a method for fabrication of a chip card.