Chip Card Module Contact Array Design for Dual Mounting
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Solution Overview
Problem
Conventional nano-SIM chip card modules are larger than necessary for permanent incorporation on printed circuit boards, leading to wasted space, and require different form factors for receptacle and permanent mounting applications, which is inefficient.
Innovation Solution
A chip card module design with a contact array featuring six contact pads in two rows of three each, plus three additional contact pads between the rows, allowing for electrical conductivity between these additional pads and the existing rows, enabling a single module to serve both standard ISO 7816 and SMT mounting requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional nano-SIM chip card module is designed for standard receptacle use with ISO 7816 contact pad arrangement, then compatibility with standard chip card receptacles is achieved, but the module size becomes larger than necessary for permanent incorporation applications
Solution Approach 1:
The contact pad array is designed to provide both ISO 7816 standard contact arrangement and additional contact pads for SMT mounting, allowing a single module design to serve both receptacle and permanent incorporation applications. The additional contact pads are positioned to enable alternative mounting methods without interfering with standard contact functionality.
Solution Approach 2:
The solution adds contact pads in a third spatial dimension between the two rows of standard contacts, rather than expanding the module footprint. This allows additional functionality to be achieved without increasing the overall module area, enabling both standard and reduced form factor applications.
2Ease of manufacture
If separate chip card modules are produced for receptacle and permanent mounting applications, then each module is optimized for its specific use, but device complexity and production logistics increase
Solution Approach 1:
A single contact pad array design provides both ISO 7816 standard contact arrangement and additional contact pads for SMT mounting, allowing one module design to replace what would traditionally require two different module types. This universality simplifies production logistics while maintaining application-specific optimization.
Solution Approach 2:
The functionality of two separate modules (receptacle-type and SMT-mounted) is merged into a single contact pad array design. The array includes both the standard six contact pads and three additional contact pads, enabling either mounting method to be used with the same physical component design.
3Adaptability or versatility
If additional contact pads are added between the two rows for SMT mounting, then versatility for both receptacle and permanent incorporation is achieved, but contact pad arrangement complexity increases
Solution Approach 1:
Additional contact pads are positioned in the space between the two rows of standard contacts, utilizing the available vertical dimension rather than expanding the horizontal footprint. This arrangement adds functionality while maintaining a compact form factor and minimizing interference with standard contact functionality.
Solution Approach 2:
The additional contact pads are strategically positioned only in specific locations between the standard contact rows where they provide maximum utility for SMT mounting without interfering with the standard ISO 7816 contact arrangement. This localized addition minimizes overall complexity while achieving the desired versatility.
Data Source
AI summary
In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.