Chip Card Module Layout for Precise Post-Lamination Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in fabricating chip cards lies in precisely positioning connections between modules and conductive circuits, both along their thickness and in a plane parallel to their main surfaces, particularly when adding additional functional modules such as biometric sensors or display devices.
Innovation Solution
A method is introduced where additional cavities are created in the card body to house secondary modules, which are connected to the conductive circuit either before or after lamination, ensuring precise alignment and protection of sensitive components like batteries during the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional functional modules are integrated into the chip card, then the functionality of the card is enhanced, but the complexity of positioning connections between modules and conductive circuits increases
Solution Approach 1:
The card body is divided into multiple cavities, each housing a specific module. This segmentation allows independent positioning and connection of each module to the conductive circuit, reducing the overall positioning complexity while enabling multiple functions.
Solution Approach 2:
The connection positioning problem is solved by utilizing the thickness dimension of the card body. Cavities are created at different depths and positions along the thickness, allowing modules to be connected to the conductive circuit from different spatial perspectives, thereby simplifying the connection process.
2Reliability
If modules are connected to the conductive circuit after lamination, then sensitive components like batteries are protected from degradation, but the precision of connection positioning becomes more difficult
Solution Approach 1:
The conductive circuit is pre-laminated into the card body before modules are installed. This preliminary action ensures the circuit is already in place and protected, and modules can be precisely positioned and connected afterward without exposing sensitive components to degradation during the lamination process.
Solution Approach 2:
Modules are nested into cavities within the card body, with the conductive circuit already embedded in the card structure. This nesting approach allows precise connection positioning while protecting sensitive components, as modules are installed into pre-prepared spaces rather than being subjected to the lamination process itself.
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The invention relates to a chip card (1) comprising a card body made of plastic material and having several functions possibly managed by a controller (18) and energy supplied by an electrical energy power supply device, such as a battery (19). Various components, like a chip for bank transactions (16), a sensor of biometric characteristics (5), a display device, etc. may be incorporated in modules placed in cavities (6, 7) formed in constituent layers (8, 10) of the body of the card (1). The invention relates also to a method for fabricating such a chip card.