Chip Card Module Connection Wells Using Conductive Polymer Adhesion
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Solution Overview
Problem
Existing dual-interface chip cards face challenges in providing a robust and reliable electrical connection between the module and antenna that can withstand handling operations while being economical.
Innovation Solution
A method involving the use of a dielectric substrate with conductive particles in polymer material, which is deposited and set to form a flexible electrical circuit, allowing for storage and subsequent connection to an antenna with controlled viscoelastic properties, enabling reliable adhesion and connection through pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical connection methods are used between module and antenna, then connection robustness and reliability are improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent changes the physical and chemical parameters of the connection material by using polymer material with conductive particles that exhibits viscoelastic properties. The material's viscosity and elasticity parameters are optimized to provide both reliable electrical connection and mechanical robustness during handling, while enabling simple deposition processes that reduce manufacturing complexity and cost.
Solution Approach 2:
The patent employs composite material consisting of polymer base material combined with conductive particles. This composite provides both the electrical conductivity needed for signal transmission and the mechanical properties required for robust connections during handling and storage, eliminating the need for separate structural and conductive components.
2Ease of manufacture
If polymer material with conductive particles is deposited to form flexible electrical circuits, then manufacturing economy and flexibility are improved, but connection robustness during handling operations deteriorates
Solution Approach 1:
The patent utilizes and optimizes the viscoelastic parameters of the polymer material. By controlling the viscosity and elasticity characteristics of the polymer with conductive particles, the material provides sufficient mechanical strength and connection robustness during handling operations while maintaining the flexibility and ease of deposition required for economical manufacturing.
3Adaptability or versatility
If modules are stored on substrates for extended periods before use, then production flexibility is improved, but material stability and connection integrity deteriorate
Solution Approach 1:
The patent optimizes the chemical and physical parameters of the polymer material to enhance its long-term stability. The polymer composition and crosslinking characteristics are designed to resist degradation during extended storage periods, maintaining connection integrity and electrical performance while allowing flexible production scheduling and module storage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures a robust and economical connection between the chip card module and antenna, maintaining integrity during handling and storage, with viscoelastic properties facilitating easy integration into card bodies.
Implementation Method 1
The polymer material comprising conductive particles undergoes setting. This setting stage is obtained spontaneously or by the implementation of one or more additional operations.
Implementation Method 2
enabling reliable adhesion and connection through pressure application
Implementation Method 3
Optionally, the method comprises an operation of crosslinking the conductive polymer material after the substrate has been rolled up or stacked on itself. This crosslinking operation is targeted at conferring, on the conductive polymer material, its definitive rheological properties.
Implementation Method 4
conferring, on the conductive polymer material, its definitive rheological properties
Implementation Method 5
either irradiation under ultraviolet radiation, exposure to a heat source, and the like). Setting occurs prior to a storage operation
Implementation Method 6
A method involving the use of a dielectric substrate with conductive particles in polymer material, which is deposited and set to form a flexible electrical circuit
Data Source
AI summary
Method for the manufacture of a chip card module in which a polymer material including conductive particles is deposited in two connection wells or on two conductive pads formed in a conductive sheet positioned on the back face of the module. This polymer material forms, after deposition, an excess thickness on the back face which comes, during the insetting of the module, into contact with the ends of an antenna. Between the manufacture of the modules and their insetting, the modules are positioned on a strip which can be rolled up on itself for the purpose of its storage.