Chip-Card Module Graphic Personalization via Segmented Engraving
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Solution Overview
Problem
Current methods for graphic personalization of chip-card modules are costly and complex, limiting design possibilities and mechanical reliability, especially with standard gold-plating technology, and result in excessive gold consumption.
Innovation Solution
A process combining extreme surface engraving technology, such as laser engraving, with standard engraving techniques to create graphic designs on chip-card modules, where one part of the design crosses the metallized contacts completely and the other part is formed superficially on the upper surface, reducing the need for conductive vias and gold usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard gold-plating technology with electrolysis is used for graphic personalization, then metallic continuity and design flexibility are achieved, but manufacturing cost and complexity increase excessively
Solution Approach 1:
The graphic personalization is divided into two distinct parts: a first part that completely crosses the metallized contacts (achieved through standard engraving techniques) and a second part that is formed only superficially on the upper surface (achieved through laser marking). This segmentation allows each part to be manufactured using optimized techniques for its specific requirements, reducing overall manufacturing complexity while maintaining design flexibility.
Solution Approach 2:
The patent replaces complex electrolysis-based gold-plating techniques with a combination of mechanical/physical engraving methods and laser marking. Specifically, the second part of the graphic personalization is created using laser marking technology, which substitutes the complex electrochemical deposition process with a more straightforward optical-thermal process, thereby reducing manufacturing complexity.
2Adaptability or versatility
If total etching of pads with conductive vias is used, then graphic personalization is achieved, but mechanical strength reliability is reduced
Solution Approach 1:
Instead of completely etching through the metallized contacts (total etching), the patent applies partial action by forming the second part of the graphic personalization only on the upper surface portion of the metallized contacts. This partial engraving approach maintains the structural integrity and mechanical strength of the contact pads while still achieving the desired graphic personalization effect.
Solution Approach 2:
The engraving process is segmented into two parts: the first part that crosses the metallized contacts completely (providing graphic definition) and the second part that remains superficial (preserving mechanical strength). This segmentation allows the design to achieve graphic personalization without compromising the mechanical reliability of the contact structure.
3Reliability
If conductive vias through substrate are used, then electrical connection is achieved, but gold consumption increases excessively
Solution Approach 1:
The patent extracts and eliminates the need for conductive vias through the substrate by using a different approach to achieve electrical connection. Instead of drilling and plating conductive pathways through the entire substrate, the invention uses surface-level metallized contacts with engraving, thereby removing the source of excessive gold consumption while maintaining electrical connectivity.
Solution Approach 2:
The patent changes the fundamental parameter of how electrical connections are established: from three-dimensional conductive vias through the substrate to two-dimensional surface metallized contacts. This parameter change eliminates the need for extensive gold plating in via structures, significantly reducing gold consumption while maintaining electrical connection reliability.
4Adaptability or versatility
If extreme surface engraving technology is used for graphic personalization, then design complexity and mechanical strength are improved, but manufacturing precision requirements increase
Solution Approach 1:
The graphic personalization is segmented into two parts manufactured by different processes: the first part (crossing the metallized contacts) is created using standard engraving techniques with conventional precision requirements, while the second part (superficial surface marking) is created using laser marking with different precision characteristics. This segmentation allows each process to operate within its optimal precision range, managing overall manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective, ecologically friendly, and reliable graphic personalization with improved mechanical strength and larger chip reception areas, enabling more complex designs without compromising mechanical reliability.
Implementation Method 1
a second part (2B, 12B) is formed only superficially by marking on the upper surface of the metallizations
Data Source
AI summary
Provided is a process for manufacturing a standard chip-card module comprising metallized contacts (P1-P6) defining a graphic design comprising visible parts formed from lines, segments or dots, a first portion (2A, 12A) of which passes right through the thickness of the metallized contacts (P1-P6) and a second portion (2B, 12B) of which is formed only superficially on the upper external surface of the metallized contacts (P1-P6). The second portion (2A, 12A) is produced in the continuity of the first portion, to form said graphic design. Other embodiments directed to a module resulting from the process is disclosed.