Chip-Card Module Solder Layout for Precise Component Integration
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Solution Overview
Problem
The integration of electronic components into chip cards during lamination can lead to component deterioration, bulging, and imprecision in connection regions, posing challenges in manufacturing chip-card modules.
Innovation Solution
A process involving a dielectric substrate with conductive layers, where an integrated circuit is connected using wire-bonding or flip-chip technology with meltable solder, allowing for the secure integration of sensitive electronic components without exposing them to lamination, and using a solder mask to control solder spread during reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic components are integrated into the chip card body during lamination, then the card body structure is simplified, but the components deteriorate and connection precision deteriorates
Solution Approach 1:
The patent divides the card body into distinct layers: a support layer and a laminate layer. The electronic components are integrated into the support layer before lamination, while the laminate layer is subsequently applied. This segmentation allows components to be protected from lamination damage while maintaining structural integration.
Solution Approach 2:
The electronic components are positioned and fixed onto the support layer before the lamination process begins. This preliminary action ensures that components are securely in place and protected during subsequent lamination operations, preventing deterioration and maintaining connection precision.
2Reliability
If electronic components are inserted between laminated layers, then lamination can proceed without component damage, but unsightly bulges appear and connection precision deteriorates
Solution Approach 1:
The patent defines specific integration zones within the support layer where electronic components are positioned. These zones are designed to accommodate components without creating bulges, and connection regions are separately defined with precise dimensional tolerances. This segmentation ensures both component protection and manufacturing precision.
Solution Approach 2:
The support layer is designed with different local properties: integration zones for housing components with appropriate thickness and flexibility, and connection zones with precise dimensional control for electrical connections. This local differentiation allows components to be protected while maintaining precise connection regions without bulging.
3Reliability
If reflow soldering is performed before wire bonding, then solder connections are established, but connection pads become contaminated and wire bonding quality deteriorates
Solution Approach 1:
The patent performs wire bonding operations before reflow soldering. The integrated circuit is first bonded to the support layer using wire bonding techniques, establishing electrical connections. Only after this preliminary action is completed is the reflow soldering performed to secure electronic components. This sequence prevents solder contamination of wire bonding pads while ensuring both connection types are established.
4Strength
If chip is connected using flip-chip technology with meltable solder, then connection strength is improved, but the same solder may contaminate wire bonding pads if reflow is performed first
Solution Approach 1:
The patent performs wire bonding before reflow soldering operations. The integrated circuit is bonded to the support layer using wire bonding techniques, establishing electrical connections. Only after this preliminary action is completed is the reflow soldering performed to secure electronic components. This sequence prevents solder contamination of wire bonding pads while ensuring both connection types are established.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enables the reliable and precise integration of electronic components into chip-card modules, reducing issues like the tombstone effect and ensuring stable connections, thus improving the manufacturing efficiency and quality of chip-card modules.
Implementation Method 1
at least one electronic component is connected to the second connection pads by reflowing the solder deposited beforehand on the second connection pads
Data Source
AI summary
Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.