Chip Card Substrate with Predetermined Breaking Lines for Machine Separation
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Solution Overview
Problem
The manual removal of ID-000 chip cards from a substrate is labor-intensive, leading to inefficiencies despite potential material and cost savings from using a substrate in ID-1 format, as most mobile devices are not designed for ID-1 format chip cards, resulting in material waste and handling difficulties.
Innovation Solution
A chip card substrate with predetermined breaking lines, allowing for easy mechanical detachment of chip card substrate portions by generating a bending moment along these lines, enabling efficient machine processing and handling, with primary and secondary breaking lines facilitating the separation of chip cards or chip card blanks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If chip cards are manually removed from substrate, then material saving and cost reduction are achieved, but labor intensity increases and processing efficiency decreases
Solution Approach 1:
The substrate is divided into multiple card positions with predetermined breaking lines between them, allowing individual cards to be separated while maintaining the integrity of the remaining cards on the substrate. This segmentation enables automated separation processes without manual intervention.
Solution Approach 2:
Predetermined breaking lines are pre-formed in the substrate during manufacturing, creating weak points that facilitate easy separation. This preliminary action prepares the substrate for automated card removal without requiring manual effort during the separation process.
2Ease of manufacture
If breaking line intersects with chip card edge, then separation is simplified, but chip card integrity is compromised
Solution Approach 1:
The breaking line is positioned specifically in the non-conductive substrate material between cards, avoiding intersection with chip card edges. This local positioning maintains different qualities: the breaking line provides separation ease while the card edges maintain their integrity for proper insertion and electrical contact.
3Productivity
If multiple chip cards are processed simultaneously on ID-1 substrate, then processing efficiency improves, but device compatibility decreases
Solution Approach 1:
The ID-1 substrate is segmented into multiple ID-000 card positions, allowing batch processing of multiple cards simultaneously. Each separated card maintains the smaller ID-000 format that is compatible with mobile devices, while the processing infrastructure can handle multiple cards at once for improved efficiency.
Solution Approach 2:
The substrate design supports multiple card formats and configurations. The same substrate structure can produce cards for different device types, and the breaking line system works universally across different card positions and orientations, enabling flexible production for various applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and efficient mechanical detachment and processing of ID-000 chip cards from a substrate, reducing material waste and handling effort, while allowing for use in both ID-1 and ID-000 formats, thereby improving handling and processing efficiency.
Implementation Method 1
at least one chip card substrate portion is accordingly broken off by generating a bending moment along the primary predetermined breaking line
Data Source
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Figure 5~6
AI summary
A chip card substrate (1) has at least one primary predetermined breaking line (5) which extends from a first side of the chip card substrate (1) to a second side of the chip card substrate (1) that lies opposite the first side. Along said primary predetermined breaking line (5), at least one chip card substrate portion (4) can be broken off from the chip card substrate (1), said chip card substrate portion (4) comprising at least one chip card (4a, 4b, 4c, 4d) or one chip card blank (4a, 4b, 4c, 4d).