Chip Card Substrate with Predetermined Breaking Lines for Machine Separation

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Solution Overview

Problem

The manual removal of ID-000 chip cards from a substrate is labor-intensive, leading to inefficiencies despite potential material and cost savings from using a substrate in ID-1 format, as most mobile devices are not designed for ID-1 format chip cards, resulting in material waste and handling difficulties.

Innovation Solution

A chip card substrate with predetermined breaking lines, allowing for easy mechanical detachment of chip card substrate portions by generating a bending moment along these lines, enabling efficient machine processing and handling, with primary and secondary breaking lines facilitating the separation of chip cards or chip card blanks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If chip cards are manually removed from substrate, then material saving and cost reduction are achieved, but labor intensity increases and processing efficiency decreases

Engineering Contradiction:
Improvesubstrate material wasteVSAvoidchip card separation efficiency
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The substrate is divided into multiple card positions with predetermined breaking lines between them, allowing individual cards to be separated while maintaining the integrity of the remaining cards on the substrate. This segmentation enables automated separation processes without manual intervention.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Predetermined breaking lines are pre-formed in the substrate during manufacturing, creating weak points that facilitate easy separation. This preliminary action prepares the substrate for automated card removal without requiring manual effort during the separation process.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If breaking line intersects with chip card edge, then separation is simplified, but chip card integrity is compromised

Engineering Contradiction:
Improveseparation process simplicityVSAvoidchip card edge integrity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The breaking line is positioned specifically in the non-conductive substrate material between cards, avoiding intersection with chip card edges. This local positioning maintains different qualities: the breaking line provides separation ease while the card edges maintain their integrity for proper insertion and electrical contact.

Inventive Principle:
Principle #3Local quality

3Productivity

If multiple chip cards are processed simultaneously on ID-1 substrate, then processing efficiency improves, but device compatibility decreases

Engineering Contradiction:
Improvebatch processing efficiencyVSAvoidmobile device compatibility
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The ID-1 substrate is segmented into multiple ID-000 card positions, allowing batch processing of multiple cards simultaneously. Each separated card maintains the smaller ID-000 format that is compatible with mobile devices, while the processing infrastructure can handle multiple cards at once for improved efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate design supports multiple card formats and configurations. The same substrate structure can produce cards for different device types, and the breaking line system works universally across different card positions and orientations, enabling flexible production for various applications.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy and efficient mechanical detachment and processing of ID-000 chip cards from a substrate, reducing material waste and handling effort, while allowing for use in both ID-1 and ID-000 formats, thereby improving handling and processing efficiency.

Implementation Method 1

at least one chip card substrate portion is accordingly broken off by generating a bending moment along the primary predetermined breaking line

Methodology Applied
Scientific EffectBending moment:

Data Source

PatentEP2417562B1Substrate having chip cards that can be separated by machine
Publication Date: 2015.11.25 GIESECKEDEVRIENT IP
  • EP2417562B1 patent drawingFigure 1~2
  • EP2417562B1 patent drawingFigure 3~4
  • EP2417562B1 patent drawingFigure 5~6

AI summary

A chip card substrate (1) has at least one primary predetermined breaking line (5) which extends from a first side of the chip card substrate (1) to a second side of the chip card substrate (1) that lies opposite the first side. Along said primary predetermined breaking line (5), at least one chip card substrate portion (4) can be broken off from the chip card substrate (1), said chip card substrate portion (4) comprising at least one chip card (4a, 4b, 4c, 4d) or one chip card blank (4a, 4b, 4c, 4d).