Chip Card Dual Interface Electromagnetic Wave Concentrator

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Solution Overview

Problem

Current hybrid chip cards with dual contact and contactless communication interfaces face manufacturing inefficiencies and reliability issues due to complex production methods, fragile components, and high costs, limiting their service life and application scope.

Innovation Solution

A microelectronic module with a substrate bearing electric contacts and an antenna, integrated with a card body containing a device for concentrating and/or amplifying electromagnetic waves, which channels electromagnetic flow from a contactless reader to the antenna, eliminating the need for electrical interconnections and enhancing manufacturing efficiency and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If the contactless chip and antenna are integrated into the card body with large antenna size, then the communication range is improved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improveantenna sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Length of stationary objectVSDevice complexity

Solution Approach 1:

The card is divided into two independent parts: a contactless inlay (with chip and antenna) and a contact card body. The inlay is a self-contained unit that can be manufactured separately and then inserted into the card body, eliminating the need for complex integrated manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contactless inlay is nested within the contact card body. The inlay contains its own chip and antenna components, and is housed in a cavity within the card body structure, allowing both contactless and contact functionalities to coexist in a compact form.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If the card body is printed with UV-sensitive inks and security mechanisms, then the security and identity control functionality is improved, but the manufacturing efficiency decreases

Engineering Contradiction:
Improvesecurity functionalityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The contactless inlay is manufactured and tested as a complete, functional unit before being inserted into the card body. This preliminary completion of the inlay ensures that security features and electronics are verified independently, allowing parallel manufacturing processes and reducing overall production time.

Inventive Principle:
Principle #10Preliminary action

3Shape

If high pressures and temperatures are applied during card body manufacturing, then the card structure is formed, but the contactless chip and antenna become fragile and service life is reduced

Engineering Contradiction:
Improvecard structureVSAvoidservice life
Core Design Contradiction:
ShapeVSDuration of action of stationary object

Solution Approach 1:

The contactless inlay is designed and manufactured as a separate, pre-assembled unit with its chip and antenna protected from the high pressure and temperature conditions of card body manufacturing. The inlay is then inserted into the finished card body, shielding it from damaging conditions and preserving its service life.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Ease of manufacture

If the contact electronic module and contactless inlay are manufactured separately and assembled, then the manufacturing flexibility is improved, but the production time and cost increase

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidproduction time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The contactless inlay is manufactured, tested, and prepared as a complete functional unit before the card body is finalized. This preliminary completion allows the inlay to be quickly inserted into the pre-formed card body cavity, reducing assembly time and enabling parallel manufacturing of components.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves card performance, increases manufacturing efficiency by 15%, reduces costs, and ensures a longer service life of up to 10 years, making it suitable for demanding applications like identity cards and electronic passports.

Implementation Method 1

a device for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received from a contactless chip card reader toward the coils of the antenna of the microelectronic module

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8317108B2Chip card with dual communication interface
Publication Date: 2012.11.27 SMART PACKAGING SOLUTIONS SPS
  • US8317108B2 patent drawing
  • US8317108B2 patent drawing
  • US8317108B2 patent drawing

AI summary

The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).