Chip Card Wiring Layout That Resists Milling Damage
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Solution Overview
Problem
Existing methods for connecting multiple electronic components in data-bearing cards, such as chip cards, face issues with electrical short-circuiting due to production tolerances during milling, leading to severed connections between contact pads.
Innovation Solution
A wiring layout using a continuous wire in a double meander form for contact pads, allowing for reliable electrical connections that are less affected by milling, or using additional electrically conducting elements or materials to connect contact pads directly or indirectly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If contact pads are milled into during cavity milling, then the cavity can be created for electronic component insertion, but the wire connection between contact pads is severed
Solution Approach 1:
The wire connection is moved from a two-dimensional planar layout to a three-dimensional立体 structure by routing the wire through the thickness direction of the card body, connecting contact pads on different layers. This spatial reconfiguration allows the wire to bypass the milling zone entirely, eliminating the risk of severance while maintaining electrical connectivity.
Solution Approach 2:
The card body is divided into multiple layers with contact pads distributed on different levels. The wire connection is segmented into multiple sections that traverse through intermediate layers via drilled holes or recesses, rather than spanning across the entire surface. This segmentation isolates the wire path from the milling operation zone.
2Ease of manufacture
If a continuous wire is used to form contact pads in meandering form, then production expenditure is reduced, but the connection is vulnerable to milling damage
Solution Approach 1:
The wire is routed through the thickness dimension of the card body by drilling holes or creating recesses, transforming the connection from a surface-level meandering path to a three-dimensional trajectory. This allows the wire to connect contact pads on different layers while avoiding the horizontal milling zone, maintaining both cost-effectiveness and reliability.
Solution Approach 2:
The continuous wire is divided into multiple segments that connect contact pads on different layers through intermediate connection points. Each segment is routed through drilled holes or recesses, creating a multi-stage connection path that reduces exposure to milling damage while maintaining the cost advantage of using a single wire type.
3Ease of operation
If contact pads are exposed during milling, then electrical connection to electronic components is enabled, but production tolerances cause lateral milling into contact pads
Solution Approach 1:
Contact pads are positioned on different layers of the card body rather than all on the same surface. The wire connects these pads through the thickness direction via drilled holes or recesses. This vertical stacking arrangement separates the contact pad locations from the horizontal milling zone, enabling electrical connection while protecting pads from lateral milling intrusion.
Solution Approach 2:
The electrical connection system is segmented into multiple contact pads distributed on different layers, each accessible through its own drilled hole or recess. This segmentation allows precise control over each connection point's location and protection, isolating them from the general milling area and reducing the impact of production tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures stable electrical connections between contact pads, even in the presence of production tolerances, maintaining connectivity during card assembly.
Implementation Method 1
The wire is in this case laid in an ultrasonically assisted manner, so that it digs itself into the surface of the card inlay
Data Source
AI summary
Electronic components of a chip card are connected to one another in an electrically conducting manner and include two contact terminals of one of the two electronic components being connected to one another in an electrically conducting manner either directly or by way of associated contact pads in the card body.