Chip Carrier Cavity Control via Segmented Resin and Sacrificial Blocks
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Solution Overview
Problem
Existing chip carriers face challenges in controlling cavity dimensions and forming deep cavities with precise dimensions, as well as accommodating various shapes and materials, which affects the performance and reliability of electronic devices.
Innovation Solution
A method of manufacturing a carrier with a cavity involves forming a wall using multiple resin layers and metal tracks/vias, where blocks of different materials are used to create the cavity shape, allowing for precise control of dimensions and filling with a secondary resin, enabling the formation of carriers with cavities greater than 30 µm in height and various shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form cavity walls, then manufacturing process is simple, but cavity dimension control is poor and deep cavities with precise dimensions cannot be formed
Solution Approach 1:
The cavity wall is divided into multiple levels, with each level formed by depositing resin layers around sacrificial blocks. This segmentation allows precise control of each level's dimensions while maintaining overall manufacturing feasibility. The multi-level approach enables deep cavities to be constructed with accurate dimensional control at each stage.
Solution Approach 2:
Sacrificial blocks are positioned in advance at the desired cavity location before resin deposition begins. These pre-placed blocks serve as templates that define the cavity shape and dimensions. The blocks are removed after resin curing, leaving precisely formed cavities with controlled dimensions.
2Adaptability or versatility
If single-material structure is used, then manufacturing is easier, but adaptability to various shapes and materials is limited
Solution Approach 1:
The carrier structure combines multiple materials including resin layers, metal tracks, metal vias, and sacrificial blocks made of different materials. This composite approach allows the final structure to accommodate various shapes and material requirements while maintaining manufacturing feasibility through systematic assembly of different material components.
Solution Approach 2:
The multi-level resin and metal structure serves multiple functions: it forms the cavity wall, provides mechanical support, enables electrical connectivity through tracks and vias, and allows accommodation of various chip shapes and materials. The standardized multi-level construction method can adapt to different application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for better control of cavity dimensions, enables the formation of carriers with large cavities, and provides a solid, opaque structure that prevents delamination, while allowing for the creation of conductive tracks and vias with various shapes, enhancing the reliability of electronic devices.
Implementation Method 1
forming a wall surrounding the cavity, the wall comprising at least one first level, wherein forming each first level comprises forming a layer of a first resin around a first block
Implementation Method 2
forming metal vias crossing the base in front of the cavity
Data Source
AI summary
An integrated circuit chip carrier includes a wall surrounding a cavity. The wall includes one or more levels where each level is formed from a layer of a resin around a block. The block is made of a material different from the resin. The block is removed to open the cavity.