Semiconductor Chip Carrier Fixing Layer Removal via Gap Chemistry
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Solution Overview
Problem
Current multi-chip stacked packaged technologies face challenges in handling substrates, leading to potential defects during the fabrication of semiconductor devices, particularly due to the temporary carrier methods used for thin substrates which can damage active surfaces and result in low fabrication yields.
Innovation Solution
A method involving attaching a semiconductor substrate to a carrier using a carrier fixing layer, forming gaps between semiconductor chips, and filling these gaps with chemicals to remove portions of the carrier fixing layer, allowing for the separation of chips while minimizing damage and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a carrier is temporarily attached to a thin substrate to handle it during fabrication, then the substrate can be handled more easily, but the active surface of the semiconductor chips may be damaged
Solution Approach 1:
The substrate is divided into individual chip regions with gaps between them. The carrier fixing layer is selectively removed from the gap regions, creating separate handling zones for each chip while maintaining overall substrate integrity during processing.
Solution Approach 2:
The carrier fixing layer has different properties in different regions: it maintains strong adhesion in chip regions to protect active surfaces, while allowing selective removal in gap regions to enable carrier separation and chip individualization without damaging the chips.
2Productivity
If the carrier fixing layer is removed completely to separate chips, then chip individualization is achieved, but the fabrication yield decreases due to increased damage risk
Solution Approach 1:
Gaps are formed between adjacent chips before complete carrier fixing layer removal. This preliminary structuring creates controlled separation zones that guide the subsequent carrier fixing layer removal process, enabling clean chip individualization while maintaining protection during the transition.
3Manufacturing precision
If chemical filling is used to remove the carrier fixing layer, then precise control of removal is achieved, but additional process steps are required
Solution Approach 1:
Chemicals are introduced as an intermediary medium to selectively remove the carrier fixing layer from gap regions. The chemicals fill the gaps and selectively etch or dissolve the fixing layer material, providing precise control over removal while protecting the semiconductor chips through the gap geometry and selective chemistry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of chip damage and enhances fabrication yield by allowing for easier removal of the carrier and reducing the contact area between the carrier and semiconductor chips, making the process more efficient and effective.
Implementation Method 1
filling the gaps with one or more chemicals to remove portions of the carrier fixing layer exposed in respective ones of the gaps
Implementation Method 2
filling the gaps with the one or more chemicals for a time sufficient to allow portions of the carrier fixing layer to be removed under the first semiconductor chips
Implementation Method 3
irradiating light to each of the gaps to remove portions of the carrier fixing layer corresponding to respective ones of the gaps
Implementation Method 4
The light may be laser light or ultraviolet light
Data Source
AI summary
A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.