Chip Carrier With Roughened Encapsulation Section
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Solution Overview
Problem
Existing chip carriers face challenges in achieving reliable manufacturing while ensuring the reliability of power modules, particularly in automotive applications, where harsh conditions such as heat and mechanical loads can lead to delamination and reduced operational stability.
Innovation Solution
A chip carrier design featuring a mounting section configured for sintering with a sinterable material and an encapsulation section with a roughened surface for improved adhesion with the encapsulant, which suppresses delamination and enhances thermal dissipation, using techniques like etching and microstructuring to create a stable and robust connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip carrier uses a smooth surface for mounting electronic chips, then the sintering process is simpler, but the adhesion between the encapsulant and the chip carrier is poor, leading to delamination under thermal and mechanical loads
Solution Approach 1:
The chip carrier surface is differentiated into two distinct zones: a smooth mounting section for electronic chip sintering and a roughened encapsulation section for enhanced encapsulant adhesion. This local quality differentiation allows each area to optimize its function without compromising the other, resolving the contradiction between manufacturing simplicity and adhesion reliability.
Solution Approach 2:
The chip carrier surface is segmented into functionally distinct areas: a mounting section with smooth surface characteristics and an encapsulation section with roughened surface characteristics. This segmentation enables independent optimization of each zone's properties, achieving both easy chip mounting and reliable encapsulant adhesion.
2Reliability
If the chip carrier surface is roughened to improve encapsulant adhesion, then delamination is suppressed, but the sintering process becomes more complex and manufacturing effort increases
Solution Approach 1:
Rather than uniformly roughening the entire chip carrier surface, the invention applies surface roughening only to the encapsulation section while maintaining a smooth mounting section. This localized approach improves encapsulant adhesion and suppresses delamination without unnecessarily complicating the overall device structure or manufacturing process.
Solution Approach 2:
The chip carrier is segmented into functional zones with different surface characteristics: a smooth mounting section for simple chip sintering and a roughened encapsulation section for improved adhesion. This segmentation achieves enhanced mechanical reliability without requiring complex device architecture.
3Reliability
If a uniform surface is used for both mounting and encapsulation, then the manufacturing process is simpler, but the package cannot reliably withstand harsh conditions such as heat and mechanical loads
Solution Approach 1:
The chip carrier employs local quality differentiation with a smooth mounting section for chip sintering and a roughened encapsulation section for encapsulant adhesion. This allows the package to reliably withstand harsh conditions while maintaining reasonable manufacturing simplicity through targeted surface treatment rather than uniform complex processing.
Solution Approach 2:
By segmenting the chip carrier surface into functionally distinct mounting and encapsulation sections, the invention achieves operational stability under harsh conditions without requiring uniformly complex manufacturing processes. Each segment can be optimized and manufactured independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high mechanical and thermal reliability, preventing delamination and ensuring reliable operation under harsh conditions, while maintaining simplicity in manufacturing processes.
Implementation Method 1
a mounting section configured for mounting an electronic chip by sintering
Implementation Method 2
an encapsulation section configured (in particular roughened) for being encapsulated by an encapsulant with proper adhesion
Data Source
AI summary
A chip carrier for carrying an electronic chip, wherein the chip carrier comprises a mounting section configured for mounting an electronic chip by sintering, and an encapsulation section configured for being encapsulated by an encapsulant.