Inclinable Chip Chuck Support for Accurate Die Bonding
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Solution Overview
Problem
Die bonders face challenges in maintaining the accuracy of semiconductor device chip positioning due to lateral movement of the collet holder, leading to deviation during chip mounting on resin boards or silicon wafers.
Innovation Solution
A chip conveying apparatus with a chip chuck that uses a support base with laterally extending leaf springs, allowing the chip chuck to be inclined and supported in an air-inclinable manner, combined with a suction mechanism for precise chip handling and a laser bonding unit for fixing the chip to the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If chips are held under suction by a collet at a lower end of a bar-shaped collet holder, then the chip can be conveyed to the fixing position, but the semiconductor device chip would easily be moved laterally when the collet holder swings, causing mounting position deviation
Solution Approach 1:
The chip chuck is designed to be inclinable relative to the support base, allowing dynamic adjustment of the chip holding angle. This dynamic configuration enables the chip chuck to adapt to different operational states while maintaining precise chip positioning, resolving the contradiction between conveying capability and positioning accuracy.
Solution Approach 2:
The inclination angle of the chip chuck is changed as a key parameter to optimize both chip conveying and positioning. By adjusting this parameter, the system achieves stable chip holding during conveyance while preventing lateral movement during mounting, thus improving manufacturing precision without sacrificing operational ease.
2Productivity
If the collet holder swings during chip conveyance, then the chip can be positioned at the fixing location, but the chip would easily be moved laterally, leading to position deviation
Solution Approach 1:
The inclinable chip chuck design allows the system to dynamically adapt during the swinging motion, maintaining optimal chip holding angles throughout the conveyance and placement process. This ensures both efficient productivity and high placement accuracy by preventing lateral chip movement during dynamic operations.
Solution Approach 2:
The chip conveying system is segmented into independent functional components: the support base for stable mounting, the inclinable chip chuck for precise chip holding, and the suction mechanism for secure chip attachment. This segmentation allows each component to optimize its function, ensuring both productivity and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the deviation of the chip's position during mounting, ensuring precise alignment and reducing lateral movement, thereby enhancing the accuracy of chip placement.
Implementation Method 1
a chip chuck that holds under suction one surface of the device chip
Implementation Method 2
a fixing mechanism that fixes the chip chuck to the support base, the fixing mechanism has a plurality of leaf springs extending laterally radially from the chip chuck, and the plurality of leaf springs are pulled by one another
Data Source
AI summary
A conveying unit for conveying a device chip onto a predetermined electrode of a board has a chip chuck that holds under suction one surface of the device chip, a support base to which the chip chuck is fixed in an inclinable manner, and a moving unit that moves the support base, in which a fixing mechanism that fixes the chip chuck to the support base has a plurality of leaf springs extending laterally radially from the chip chuck, the plurality of leaf springs are connected to the support base in the surroundings of the chip chuck, and the plurality of leaf springs are pulled one another, so that the chip chuck is supported in air in an inclinable manner.