Chip Chuck Slopes for Dual-Sided Optical Inspection
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Solution Overview
Problem
Conventional chip supporting devices interfere with light emitted by light emitting chips during optical inspection, limiting the inspection of both front and back light emitting surfaces and failing to maintain specific temperature conditions for accurate results.
Innovation Solution
A chip chuck with obliquely extending front and back slopes allows both light emitting surfaces to be inspected without obstruction, combined with a temperature controller for precise temperature management, enabling simultaneous inspection of front and back surfaces under varying conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional chip supporting device with a flat top surface is used, then the structure is simple and easy to manufacture, but the chip chuck obstructs light emitted by the chip under test, causing interference during optical inspection
Solution Approach 1:
The patent transforms the flat two-dimensional top surface into a three-dimensional structure with front and back slopes. This dimensional change allows light to pass over the chip chuck without obstruction, eliminating the interference problem while maintaining manufacturing feasibility through standard machining processes.
Solution Approach 2:
The chip chuck employs asymmetric slope designs where the front slope and back slope have different angles relative to the horizontal plane. The front slope angle is designed to be greater than the back slope angle, creating an asymmetric configuration that optimizes light path clearance while maintaining structural stability and heat conduction performance.
2Object-affected harmful factors
If the chip chuck uses steep slopes to avoid light obstruction, then light interference is reduced, but the structural stability and heat conduction performance deteriorate
Solution Approach 1:
The patent optimizes the slope angles as specific parameters to balance light clearance and structural stability. The front slope angle is set between 30-60 degrees and the back slope angle between 15-45 degrees, creating an optimal parameter range that provides sufficient light path clearance while maintaining adequate structural support and heat conduction capability.
Solution Approach 2:
Different regions of the chip chuck are designed with different slope characteristics - the front slope has a steeper angle for better light clearance, while the back slope has a gentler angle for improved structural stability. This localized quality variation allows each region to perform its specific function optimally.
3Stability of the object's composition
If the chip chuck uses gentle slopes to maintain structural stability, then structural stability is improved, but light emitted by the chip is obstructed by the chip chuck
Solution Approach 1:
The asymmetric slope configuration with the front slope angle greater than the back slope angle resolves this contradiction by allocating different functional priorities to different regions. The steeper front slope prioritizes light clearance where the chip emits light forward, while the gentler back slope prioritizes structural support where stability is critical.
Solution Approach 2:
By transitioning from a flat surface to a sloped three-dimensional structure, the patent creates vertical clearance for light paths while maintaining horizontal structural footprint. This dimensional transformation allows gentle overall slopes to provide sufficient light clearance without compromising structural stability.
4Productivity
If conventional chip supporting devices are used, then only the front light emitting surface can be inspected, but the back light emitting surface cannot be inspected due to obstruction
Solution Approach 1:
The sloped three-dimensional structure creates clearance on both the front and back sides of the chip chuck, allowing optical sensors to access and inspect both the front light emitting surface and the back light emitting surface. This dimensional transformation enables dual-sided inspection capability that was impossible with a flat surface design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures accurate optical inspection of both light emitting surfaces with reduced interference and stable heat conduction, allowing for precise temperature control during the inspection process.
Implementation Method 1
resulted from the shape design with the front and back slopes, the chip chuck is approximately taper-shaped, thereby stable in structure and having so much volume as to achieve great heat conducting effect when heat conduction is required
Data Source
AI summary
A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.