Chip Circuit Module Thermal Control via Temperature-Based Power Allocation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of processors and network modules within a chip leads to increased temperature coupling, making it difficult to estimate and control junction temperatures and allocate resources effectively due to different power control interfaces.
Innovation Solution
A method for controlling circuit modules within a chip that involves obtaining temperature-related information and allocating power or throughput limits based on this information, using a heterogeneous resource allocator and adaptive throughput limit module to manage thermal issues across processors and network modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple processors and network modules are integrated into a single chip to save manufacturing cost, then manufacturing cost is reduced, but temperature coupling increases making junction temperature control difficult
Solution Approach 1:
The patent segments the thermal management system into multiple independent thermal zones, each corresponding to a specific processor or network module. Each zone has its own temperature sensor and control parameters, allowing independent temperature monitoring and control for each module. This segmentation enables precise thermal management despite the close proximity of multiple heat-generating components on the chip.
Solution Approach 2:
The system dynamically changes power allocation parameters and throughput limits based on real-time temperature readings from each thermal zone. When temperature exceeds thresholds, the system adjusts power consumption parameters of affected modules to maintain thermal safety. This parameter adaptation allows the system to respond to thermal conditions while maintaining optimal performance within thermal constraints.
2Adaptability or versatility
If different power control interfaces are used for processors and network modules, then each module can be controlled independently, but resource allocation becomes more difficult
Solution Approach 1:
The patent implements a universal resource allocation framework that can handle multiple types of modules (processors, network modules) with different control interfaces through a single unified controller. This universal allocator translates various module-specific requirements into coordinated resource allocation decisions, managing power and throughput across heterogeneous modules while considering their interdependent thermal relationships.
Solution Approach 2:
The system introduces a unified resource allocation controller as an intermediary layer between the diverse module control interfaces and the thermal management objectives. This intermediary translates temperature feedback and resource requests from various modules into coordinated power and throughput allocations, simplifying the complexity of managing multiple independent control interfaces while maintaining their individual control capabilities.
3Area of stationary object
If distance between processors and network modules is reduced within a chip, then chip size is minimized, but temperature coupling effect increases
Solution Approach 1:
The patent applies local quality by assigning different thermal management characteristics to different regions of the chip. Each module operates within its own thermal zone with zone-specific temperature thresholds and control parameters. This local differentiation allows the system to manage thermal coupling effects by treating each region according to its specific thermal conditions rather than applying uniform thermal management across the entire chip.
Solution Approach 2:
The system implements continuous temperature feedback from sensors in each thermal zone to the resource allocation controller. This feedback mechanism enables real-time detection of temperature coupling effects between nearby modules and triggers appropriate power or throughput adjustments to mitigate excessive thermal interaction. The feedback loop allows the system to adapt to dynamic thermal conditions resulting from close module proximity.
Data Source
AI summary
A method for controlling circuit modules within a chip is provided, wherein the circuit modules includes at least one processor and at least one network module, and the method includes: obtaining a plurality of temperature-related information of the circuit modules; and allocating power limits or throughput limits of the circuit modules according to the temperature-related information of the circuit modules, respectively.