Chip Coated LED Package With Resin Layer For Uniform Color Temperature
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Solution Overview
Problem
Conventional LED packages face issues with non-uniform color temperature due to varying light propagation lengths and leakage currents caused by contact between fluorescent materials and metal wires, limiting miniaturization and increasing manufacturing costs.
Innovation Solution
A chip coated LED package design featuring a light emitting chip attached to a submount with a resin layer containing fluorescent material, exposed bump balls for electrical connection, and a package body with a reflecting cavity or hole to ensure uniform light emission and prevent leakage currents, allowing for miniaturization and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If fluorescent material is mixed in transparent resin encapsulant, then light conversion function is achieved, but non-uniform color temperature and leakage current occur
Solution Approach 1:
The patent divides the encapsulant into two distinct parts: a transparent resin encapsulant without fluorescent material and a fluorescent resin layer containing fluorescent material. This segmentation prevents the metal wires from contacting conductive fluorescent material in the bulk resin, thereby eliminating leakage current while maintaining light conversion function in the dedicated fluorescent layer.
Solution Approach 2:
The patent extracts the fluorescent material from the transparent resin encapsulant and places it only in the fluorescent resin layer. This extraction removes the harmful conductive fluorescent material from contact with metal wires while preserving the essential light conversion function in the separated fluorescent layer.
2Use of energy by moving object
If conventional LED package structure is used, then light emission function is achieved, but miniaturization is limited
Solution Approach 1:
The patent merges the encapsulant and fluorescent layer into an integrated structure where the fluorescent resin layer is formed directly on the light emitting chip. This integration eliminates the need for separate fluorescent material mixing in the encapsulant, reducing overall package volume while maintaining light emission efficiency.
Solution Approach 2:
The patent transitions from a three-dimensional mixed fluorescent encapsulant structure to a layered two-dimensional structure where the fluorescent resin layer is positioned specifically on the chip surface. This dimensional reorganization optimizes space utilization and enables miniaturization while preserving light conversion functionality.
3Illumination intensity
If fluorescent material is placed in transparent resin, then white light generation is achieved, but color temperature uniformity deteriorates
Solution Approach 1:
The patent applies fluorescent material locally in a dedicated fluorescent resin layer on the light emitting chip, rather than distributing it throughout the entire transparent resin encapsulant. This localized placement ensures uniform interaction between blue light and fluorescent material, producing consistent color temperature across the emission surface.
4Ease of operation
If metal wires contact fluorescent material in resin, then electrical connection is achieved, but leakage current increases
Solution Approach 1:
The patent extracts conductive fluorescent material from the transparent resin encapsulant and confines it to the fluorescent resin layer, preventing contact with metal wires while maintaining electrical connection functionality through the submount structure.
Solution Approach 2:
The patent introduces a submount as an intermediary between the light emitting chip and lead frame, providing electrical connection pathways that bypass the fluorescent resin layer and prevent direct contact between metal wires and conductive fluorescent material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light efficiency by maintaining uniform color temperature and preventing leakage currents, enabling miniaturization and cost-effective mass production of LED packages.
Implementation Method 1
a fluorescent material is included in the transparent resin encapsulant 17 to obtain desired white light... a wavelength-converting means that converts a first wavelength of blue light emitted from the light emitting chip 14 to a second wavelength of white light
Implementation Method 2
a reflecting part formed on an inner surface of the cavity for reflecting light generated from the light emitting chip
Data Source
AI summary
A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.