Multilayer Chip Code Marking Before Baking to Prevent Cracking
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Solution Overview
Problem
Existing electronic components with drum cores made of sintered bodies are prone to cracking during laser marking, leading to deteriorated characteristics and potential malfunctions.
Innovation Solution
A multilayer chip component design that employs laser processing on a laminate substrate before baking, incorporating dot-shaped recesses on the surface with a semicircular cross-sectional shape to prevent cracking, where the depth of the recesses is shorter than the surface layer thickness and curvature radius, ensuring smoothness and avoiding corner stress concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If laser marking is performed on a sintered drum core, then a two-dimensional code can be marked for identification, but cracking occurs in the drum core causing component deterioration or malfunction
Solution Approach 1:
The patent applies preliminary action by forming dot-shaped recesses on the surface layer before performing laser marking. These pre-formed recesses serve as stress relief structures that prevent cracking during the subsequent laser marking process, thereby enabling reliable code marking without compromising component integrity
Solution Approach 2:
The patent employs spheroidality by designing the recesses with semicircular cross-sections rather than sharp corners. This curved geometry eliminates stress concentration points that would otherwise form at sharp edges, preventing crack initiation and propagation during laser marking while maintaining effective code representation
2Loss of information
If deep recesses are formed for code marking, then code visibility and traceability are improved, but stress concentration and cracking risk increase
Solution Approach 1:
The patent applies partial action by forming recesses that are sufficient for code marking purposes but deliberately not excessively deep. The recess depth is optimized to provide adequate code visibility and traceability while remaining within a depth range that avoids creating critical stress concentrations that would lead to cracking
Solution Approach 2:
The semicircular cross-sectional shape of the recesses eliminates sharp corners and edges that would act as stress concentrators. This curved geometry allows the recesses to achieve sufficient depth for code marking while maintaining smooth transitions that prevent stress concentration and crack initiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively curbs cracking during laser processing, enhancing the reliability and functionality of the electronic component by maintaining the integrity of the drum core and allowing for high traceability through a two-dimensional code indicating information such as ID and substrate details.
Implementation Method 1
laser processing is employed
Data Source
AI summary
In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.