Chip Identification Codes Written During Lithography
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Solution Overview
Problem
Applying chip-specific identification codes to semiconductor chips is costly due to the need for additional process steps.
Innovation Solution
Patterning a resist layer on a semiconductor wafer using laser direct image exposure to write chip-specific identification codes, which can be transferred to the resist layer or an underlying functional layer through etching, without requiring additional process steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chip-specific identification codes are applied using additional process steps, then chip tracking and verification capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the identification code marking process with the existing lithographic structuring process by integrating a marking module into the lithography system. This allows chip-specific identification codes to be written during regular lithographic processing without requiring separate additional process steps, thereby maintaining manufacturing efficiency while enabling chip tracking capability.
Solution Approach 2:
The lithographic system is enhanced with multi-functionality by adding a marking module that can perform both traditional lithographic patterning and identification code writing. This universal approach allows a single process step to achieve multiple objectives: structural patterning and identification marking, eliminating the need for dedicated marking equipment and processes.
2Measurement precision
If additional process steps are introduced for code application, then identification accuracy is improved, but process complexity increases
Solution Approach 1:
The marking process is merged with the lithographic structuring process, utilizing the same equipment and process flow. The marking module integrates with the existing lithography system, allowing identification codes to be written during the same processing step as the chip structure patterning, thereby avoiding additional process steps and reducing overall process complexity.
Solution Approach 2:
The lithographic system performs dual functions - both structuring the chip and writing identification codes - within a single process step. The system serves itself by utilizing its existing capabilities (laser direct image exposure) to accomplish the additional marking function without requiring separate dedicated marking equipment or processes.
3Productivity
If laser direct image exposure is used for patterning, then manufacturing efficiency is improved, but equipment requirements increase
Solution Approach 1:
The lithographic system is enhanced with multi-functionality by integrating a marking module that enables both traditional lithographic patterning and identification code writing. This universal equipment can perform multiple functions using the same laser direct image exposure technology, maintaining manufacturing efficiency while consolidating equipment requirements rather than adding separate marking devices.
Solution Approach 2:
The marking function is combined with the lithographic patterning function within a single integrated system. The marking module is incorporated into the existing lithography equipment, allowing both structural patterning and identification marking to be accomplished using the same laser direct image exposure capability, thereby improving efficiency without proportionally increasing equipment complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient generation of chip-specific identification codes during regular lithographic structuring, reducing costs and simplifying the process.
Implementation Method 1
patterning a resist layer over a semiconductor wafer by laser direct image exposure, thereby writing chip-specific identification codes into the resist layer
Implementation Method 2
developing the patterned resist layer
Implementation Method 3
the chip-specific identification code mark is formed as an etch mark in the functional layer
Data Source
AI summary
A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.