Chip Component With Pillar Wall Portions For Capacitor Capacity
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Solution Overview
Problem
Existing chip capacitors face challenges in simultaneously reducing element size and increasing capacitor capacity, as the capacity is restricted by the planar size of the substrate.
Innovation Solution
A chip component design featuring a substrate with pillar units forming wall portions that extend in three directions, allowing for a larger surface area and capacity without size constraints, and a support structure for enhanced stability and reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the planar size of the substrate is reduced to downsize the element, then the element size is reduced, but the capacity of the capacitor portion is restricted
Solution Approach 1:
The patent transitions from a planar capacitor structure to a three-dimensional structure by forming wall portions that extend vertically from the substrate surface. The capacitor portion is formed along the lateral surfaces of these wall portions, utilizing the vertical dimension to increase effective capacitor area without increasing the planar footprint of the substrate. This dimensional transition allows capacitor capacity to scale with wall height rather than being constrained by substrate area.
2Quantity of substance
If the wall portion height is increased to enlarge capacitor capacity, then the capacitor capacity is enlarged, but the stability of the wall portion against lateral forces deteriorates
Solution Approach 1:
The wall portion is divided into multiple pillar units arranged in an array, with each pillar unit being a separate structural element. This segmentation allows the lateral load to be distributed across multiple discrete support points rather than requiring a single monolithic wall structure. The pillar units collectively provide enhanced lateral stability while maintaining the vertical height needed for capacitor capacity.
Solution Approach 2:
Each pillar unit comprises a composite structure with a central portion and three convex portions extending in mutually different directions. This composite geometry provides both vertical support and lateral bracing, creating a structurally stable configuration that resists lateral forces while maintaining the height necessary for capacitor formation along its surfaces.
3Area of moving object
If pillar units with three convex portions are used to increase surface area, then the surface area of the wall portion is increased, but the manufacturing complexity increases
Solution Approach 1:
The pillar units are positioned at specific locations and orientations throughout the wall portion structure, with each unit's three convex portions oriented to maximize surface area in its local region. This local optimization of geometry allows the overall wall portion to achieve high total surface area without requiring every point in the structure to be complex, balancing manufacturing feasibility with capacitor area maximization.
Data Source
AI summary
A chip component includes a substrate that has a first surface and a second surface on a side opposite to the first surface, a plurality of wall portions that are formed on a side of the first surface by using a part of the substrate, that have one end portion and one other end portion, and that are formed of a plurality of pillar units, a support portion that is formed around the wall portions by using a part of the substrate and that is connected to at least one of the end portion and the other end portion of the wall portions, and a capacitor portion formed by following a surface of the wall portion, in which each of the pillar units includes a central portion and three convex portions that extend from the central portion in three mutually different directions in a plan view and in which the wall portion is formed by a connection between the convex portions of the pillar units that adjoin each other.