Semiconductor Chip Connector Structure for Universal Electrode Bonding
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Solution Overview
Problem
The use of multiple-sized metallic members in semiconductor devices for connection between electrodes and lead frames complicates the manufacturing process, leading to reduced productivity and increased costs due to the need for different types of connectors.
Innovation Solution
A semiconductor device configuration featuring a connector with a flat portion and a protruded portion, where the flat portion has a larger area than the electrode, allowing for electrical connection with a low resistance and improved heat dissipation, and an adhesion improving film enhances the connection between the connector and the resin layer, enabling the use of a single connector type for various semiconductor chip sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple types of metallic members with different sizes are used to match different semiconductor chip sizes, then the electrical connection and heat dissipation are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The metallic member is designed with a universal structure that can accommodate multiple semiconductor chip sizes. The connector has a standardized configuration with a connection portion and an extending portion, allowing it to function with different chip dimensions without requiring different connector types. This multi-functional design resolves the contradiction by enabling one connector type to serve multiple chip size applications.
Solution Approach 2:
The invention allows the metallic member's dimensions to be adjusted within a range while maintaining the same basic structure. The connection portion area is set to be equal to or larger than the electrode area, and the extending portion has specific dimensional relationships, but these parameters can be scaled to match different chip sizes without changing the fundamental connector design. This parameter flexibility enables universal applicability across different semiconductor device configurations.
2Reliability
If multiple types of metallic members with different sizes are used for different chip sizes, then the electrical connection quality is maintained, but the productivity deteriorates
Solution Approach 1:
By designing a universal metallic member that can be used across different semiconductor chip sizes, the invention eliminates the need to stock and handle multiple connector types. The standardized connector with its specific structural features (connection portion equal to or larger than electrode area, extending portion with defined dimensions) can accommodate various chip sizes, thereby improving manufacturing efficiency and productivity while maintaining connection quality.
Solution Approach 2:
The invention merges the functionality of multiple connector types into a single universal connector design. Instead of having separate connectors for small, medium, and large chips, one metallic member structure performs all these functions by adjusting its parameters within specified ranges. This consolidation simplifies the manufacturing process and improves productivity.
3Productivity
If a single type of metallic member is used for various chip sizes, then the productivity is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The invention defines specific parameter ranges and relationships for the metallic member that ensure proper functionality across different chip sizes. The connection portion area is constrained to be equal to or larger than the electrode area, the extending portion has defined length and width relationships, and the thickness is within specific ranges. These parameter specifications provide clear manufacturing guidelines that maintain precision requirements while enabling universal use.
Solution Approach 2:
The metallic member is designed with different local regions having specific functional requirements. The connection portion has area constraints relative to the electrode, the extending portion has specific dimensional relationships, and the thickness varies within defined ranges. These localized quality specifications ensure that each part of the connector performs its function correctly while maintaining overall manufacturing feasibility.
4Reliability
If the connector size is changed to match different chip sizes, then the electrical connection and heat dissipation are optimized, but the cost increases
Solution Approach 1:
The metallic member is designed as a universal component that can serve multiple chip sizes without requiring different connector specifications. The connection portion is sized to match the electrode area, and the extending portion has defined dimensional relationships, but these can be scaled within a family of similar connectors. This universal design reduces the variety of connector specifications needed while maintaining optimized heat dissipation and electrical connection performance.
Solution Approach 2:
The invention allows the metallic member dimensions to be adjusted within specific parameter ranges to optimize heat dissipation and electrical connection for different chip sizes. The connection portion area relative to electrode area, the extending portion length and width ratios, and thickness parameters can be modified within defined constraints. This parameter flexibility enables performance optimization without requiring entirely different connector designs for each chip size.
Data Source
AI summary
A semiconductor device according to the present embodiment comprises a semiconductor chip comprising a first face and a second face on an opposite side to the first face, and comprising a first electrode in the first face. A first metallic member comprises a first opposed face facing the first electrode and being larger in a profile than the first electrode, the first metallic member comprising a first protruded portion protruded from the first opposed face toward the first electrode and electrically connected to the first electrode. An insulating member coats the semiconductor chip and the first metallic member.