Semiconductor Chip Connector Structure for Reflow Alignment Stability
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Solution Overview
Problem
In semiconductor assembly processes, solder reflow can cause displacement of semiconductor chips from leads or connectors, leading to positional misalignment and potential reliability issues and short circuits.
Innovation Solution
The semiconductor device design incorporates protruded portions on connectors and conductive members with connecting members made of lower-melting-point materials like solder, which are strategically positioned to minimize displacement during reflow through surface tension, forming fillets that secure the components in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is supplied between the leads and semiconductor chip for reflow connection, then electrical connection is achieved, but the solder may move during reflow causing displacement of the semiconductor chip from the leads
Solution Approach 1:
The connector is divided into multiple protruded portions that are spaced apart from each other. Each protruded portion independently engages with corresponding recesses on the semiconductor chip, distributing the connection points and preventing solder-induced displacement of the entire chip.
Solution Approach 2:
The protruded portions are designed to engage with the semiconductor chip before solder reflow occurs. This preliminary mechanical engagement creates a constraint structure that prevents the solder from causing chip displacement during the subsequent reflow process.
2Reliability
If connectors are connected to the semiconductor chip using solder reflow, then electrical connection is established, but the connectors may be displaced from the semiconductor chip
Solution Approach 1:
The connector is segmented into multiple protruded portions spaced at intervals. This segmentation allows each portion to independently maintain positional stability during solder reflow, preventing overall connector displacement while ensuring reliable electrical connections at multiple points.
Solution Approach 2:
The protruded portions are pre-positioned on the connector before soldering. These protrusions engage with corresponding features on the semiconductor chip in advance, establishing a precise mechanical alignment that prevents displacement during the subsequent solder reflow process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses relative positional misalignment of semiconductor chips, conductive members, and connectors, enhancing the reliability and preventing short circuits by ensuring stable connections during the solder reflow process.
Implementation Method 1
A first connecting member connects the first connector and the second face of the semiconductor chip to each other. A second connecting member connects the first connector and the second conductive member to each other.
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
A device includes a first conductive-member which connects to a first electrode on a first face of a chip. A second conductive-member is spaced from the chip and the first conductive-member. A third conductive-member is spaced from the first and second conductive-members. A first connector connects between the second electrode and the second conductive-member. A second connector is opposed to a third electrode on the second face and connects the third electrode and the third conductive-member. A first connecting-member connects the first connector and the second face. A second connecting-member connects the first connector and the second conductive-member. The first connector includes first protruded portions protruded in a first direction from the first conductive-member to the second conductive-member. The second connecting-member is provided to correspond to each of places between the first protruded portions and the second conductive-member.