Semiconductor Chip Cooling Channel With Capillary Two-Phase Flow
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Solution Overview
Problem
Current semiconductor cooling systems face challenges in efficiently managing heat generated by high-power density semiconductor chips, particularly as the integration of semiconductor components increases, leading to higher thermal resistance and potential hot spots.
Innovation Solution
A semiconductor apparatus with a two-phase liquid cooling structure is introduced, featuring a cooling channel with a fine pattern that generates capillary pressure to induce coolant flow, and a temperature controller to regulate the coolant's supply temperature, ensuring efficient heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional cooling channel is used in semiconductor chips, then the structure is simple, but the heat exchange efficiency is insufficient and thermal resistance is high
Solution Approach 1:
The cooling channel wall is formed with a fine pattern of pores or grooves that generate capillary pressure to induce liquid coolant flow. This porous structure increases the surface area for heat exchange between the semiconductor chip and coolant, significantly improving heat exchange efficiency while maintaining a relatively simple overall channel structure
Solution Approach 2:
The invention changes the physical parameters of the cooling channel by introducing a fine pattern with specific pore sizes and distributions. This modifies the capillary pressure characteristics and fluid flow dynamics, enabling efficient two-phase cooling without requiring complex external pumping systems
2Device complexity
If the coolant supply temperature is not controlled, then the system is simple, but the heat exchange efficiency is reduced and hot spots may form
Solution Approach 1:
A temperature controller with temperature sensors monitors the coolant temperature and provides feedback to the heating element. This closed-loop control system adjusts the preheating power dynamically to maintain optimal coolant supply temperature, preventing hot spots and maximizing heat exchange efficiency
Solution Approach 2:
The heating element preheats the liquid coolant before it enters the cooling channel. This preliminary action ensures the coolant reaches the optimal temperature for phase change, improving heat exchange efficiency and preventing thermal shock to the semiconductor chip
3Productivity
If high-capacity pumps are used to drive coolant flow, then the cooling capacity is sufficient, but the power consumption and system cost increase
Solution Approach 1:
The fine pattern structure in the cooling channel wall generates capillary pressure that automatically drives the liquid coolant flow through the channel. This self-service mechanism eliminates the need for high-capacity external pumps, significantly reducing power consumption while maintaining sufficient cooling capacity
Solution Approach 2:
The invention replaces the mechanical pumping system with a capillary-driven flow system. The fine pattern structure creates capillary forces that substitute for mechanical pump action, reducing moving parts and power consumption while maintaining effective coolant circulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The two-phase liquid cooling system enhances heat exchange efficiency by controlling the coolant's temperature, reducing thermal resistance, and preventing hot spots, while also eliminating the need for high-capacity pumps, thereby reducing power consumption and costs.
Implementation Method 1
a fine pattern on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate a capillary pressure that induces a flow of a liquid coolant
Implementation Method 2
The temperature controller may include a heating element configured to preheat the liquid coolant supplied to the cooling channel
Implementation Method 3
a two-phase liquid cooling method in which the coolant is phase changed
Data Source
AI summary
A semiconductor apparatus includes a semiconductor chip including a semiconductor integrated circuit, a cooling channel at least partially in the semiconductor chip and including a fine pattern on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate a capillary pressure that induces a flow of a liquid coolant, and a temperature controller configured to control a supply temperature of the liquid coolant supplied to the cooling channel.