On-Chip Two-Phase Cooling Channels to Prevent Vapor Adsorption
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Solution Overview
Problem
Existing cooling systems for semiconductor devices face challenges in efficiently managing high power density and heat generation, particularly due to vapor adsorption on heating surfaces, which reduces cooling efficiency and leads to hot spots.
Innovation Solution
A two-phase liquid cooling system is implemented within the semiconductor chip, utilizing capillary forces to move liquid coolant through fine patterns in cooling channels, separating liquid and gas passages to efficiently transfer heat and remove vapor, eliminating the need for external pumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used to remove heat from semiconductor devices, then cooling efficiency is improved, but vapor adsorption to the heating surface occurs which reduces cooling efficiency
Solution Approach 1:
The cooling channel is divided into a liquid introduction region and a gas discharge region, with the heating surface segmented into areas where liquid coolant is introduced and areas where vapor is discharged. This segmentation prevents vapor adsorption on the heating surface by directing vapor to a dedicated discharge area, thereby maintaining high cooling efficiency.
Solution Approach 2:
The vapor discharge function is extracted from the general cooling channel and assigned to a specific gas discharge region. By separating the vapor discharge pathway from the liquid cooling pathway, the harmful effect of vapor adsorption on the heating surface is eliminated while preserving the cooling efficiency of the liquid coolant.
2Power
If two-phase liquid cooling method is used, then calorific value range is increased, but vapor adsorption to heating surface reduces cooling efficiency
Solution Approach 1:
Different regions of the heating surface are assigned different functions: the liquid introduction region receives liquid coolant for heat absorption, while the gas discharge region is designated for vapor removal. This local differentiation ensures that vapor does not adsorb onto active heating areas, maintaining high cooling efficiency while utilizing the full calorific value range of the two-phase cooling method.
3Temperature
If cooling channel is formed inside semiconductor chip, then thermal resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The semiconductor chip substrate serves multiple functions: it acts as both the semiconductor device platform and the housing for the cooling channel. By integrating the cooling channel within the chip substrate itself, the design achieves low thermal resistance while avoiding the need for separate cooling components, thereby reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by reducing thermal resistance, preventing vapor adsorption, and maintaining uniform cooling performance, while reducing power consumption and management costs.
Implementation Method 1
the first fine pattern is configured to generate a capillary force that moves the liquid coolant in the transverse direction along the first wall surface and the second fine pattern may be configured to generate a capillary force that moves the liquid coolant in the longitudinal direction along the second wall surface and to the first wall surface
Implementation Method 2
two-phase liquid cooling methods involving a phase change of a coolant
Data Source
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AI summary
A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.