Chip Cooling Layer with Vapor Extraction for High Density Heat Management
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Solution Overview
Problem
Existing cooling systems for high-power density servers and chips face challenges in thermal management due to their inflexibility and inability to accommodate varying power densities, particularly in single-phase and two-phase immersion cooling solutions that do not effectively support high-power density chips and lack compatibility across different cooling systems.
Innovation Solution
A thermal management device with a cooling layer, internal channel, and vapor layer, designed to efficiently manage heat through multiple cooling regions and fluid recirculation, using either single-phase or two-phase coolant, and incorporating a resistance layer to separate vapor and liquid, allowing for flexible integration into various cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single-phase immersion cooling is used, then the cooling system is simple to implement, but it cannot effectively cool high-power density chips
Solution Approach 1:
The cooling system is segmented into distinct functional layers: a cooling layer in direct contact with the chip for heat extraction, a vapor layer for phase change and heat transfer, and an internal channel for fluid recirculation. This segmentation allows each layer to optimize its specific function, enabling effective cooling of high-power density chips while maintaining system simplicity
Solution Approach 2:
The patent utilizes phase transition of the coolant between liquid and vapor states within the vapor layer. The coolant absorbs heat from the chip, evaporates to transfer latent heat, then condenses and recirculates. This phase change mechanism dramatically increases cooling efficiency for high-power density chips compared to single-phase cooling alone
2Temperature
If two-phase immersion cooling is used, then cooling efficiency is improved, but the system becomes more complex and less compatible with existing cooling systems
Solution Approach 1:
The cooling device is designed with multi-functionality to work with both single-phase and two-phase cooling systems. The same device structure can operate in single-phase mode for lower power density applications or switch to two-phase mode with vapor layer activation for high-power density applications, providing universal compatibility across different cooling system types
Solution Approach 2:
The internal channel acts as an intermediary component that facilitates fluid recirculation between the cooling layer and the external cooling system. It provides a standardized interface that can connect to various external cooling systems, reducing complexity and improving compatibility by serving as a universal mediator between the immersion cooling device and different system configurations
3Ease of operation
If rack-level fluid recirculation is used, then the cooling system is easy to implement, but local cooling acceleration is not provided
Solution Approach 1:
The cooling system is divided into local and global components: the cooling layer with internal channels provides localized cooling acceleration directly at the chip level, while the external recirculation system handles overall thermal management. This segmentation allows simultaneous operation of simple rack-level recirculation and enhanced local cooling where needed
Solution Approach 2:
The patent adds a vertical dimension to cooling by creating distinct layers (cooling layer, vapor layer, internal channel) stacked above the chip. This multi-layer vertical architecture enables local cooling acceleration in the immediate vicinity of heat-generating components while maintaining the horizontal rack-level recirculation flow path, providing cooling enhancement without complicating the overall system operation
4Temperature
If cooling solutions are designed for specific power densities, then optimization is achieved, but adaptability to varying power densities is reduced
Solution Approach 1:
The cooling device incorporates dynamic adaptability through adjustable coolant flow rates, variable power density mapping across different cooling regions, and the ability to switch between single-phase and two-phase operating modes. The system can dynamically adjust its cooling capacity to match varying power density requirements of different chips or the same chip under different workloads, maintaining optimization across a range of conditions rather than for a fixed power density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat extraction and fluid management, addressing hot spots and accommodating different server hardware and cooling systems, while supporting non-uniform power mapping and enhancing compatibility across cooling technologies.
Implementation Method 1
the two-phase coolant is then converted into mixed fluid due to the heat extracted from the chip
Implementation Method 2
Within the internal channel and the vapor layer, the vapor portion of the mixed liquid can be at least partially extracted from the mixed fluid
Data Source
AI summary
A cooling device for cooling a chip and a cooling system using the cooling device are disclosed. The cooling device includes a cooling layer, an internal channel, and a vapor layer. The cooling layer is divided into multiple cooling regions for cooling different regions of the chip. The internal connection is divided into multiple sections corresponding to the multiple cooling regions. Two-phase coolant entering the cooling layer is converted to mixed fluid, which is elevated to each internal section, where at least a portion of the vapor in the mixed fluid is extracted and the remaining mixed fluid is either distributed to the next cooling region or exit the cooling device. The cooling system includes at least one such cooling device, a fluid loop for recirculating liquid in the mixed fluid in the loop, and a vapor loop for recirculating vapor in the mixed fluid exiting the cooling device.