Semiconductor Chip Corner Region IO Cell Grid Layout
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Solution Overview
Problem
Conventional semiconductor integrated circuit chips with miniaturized fabrication processes face challenges in efficiently utilizing corner portions due to sparse IO cell arrangements, leading to dead space and reduced circuit core placement areas.
Innovation Solution
The semiconductor integrated circuit chip is designed with a configuration that includes specific linear regions around the corner portions for placing IO cells connected to electrode pads, allowing for a wider circuit core placeable region by rearranging basic patterns and optimizing power supply interconnects, thereby utilizing previously vacant spaces effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If IO cells are arranged in linear regions connected to electrode pads in n rows from the outer edge, then the connection density is improved, but corner portions become dead space with sparse IO cell arrangement
Solution Approach 1:
The patent transitions from arranging IO cells only in linear regions to utilizing two-dimensional corner portions of the chip. By defining corner portions as regions adjoining both the first and second linear regions, the invention fills the previously wasted corner spaces with IO cells arranged in a grid pattern (n rows × n columns), effectively converting dead space into productive areas.
Solution Approach 2:
The patent applies different arrangement strategies to different regions of the chip. Linear regions maintain their linear IO cell arrangement for direct pad connections, while corner portions utilize dense grid arrangements. This localized differentiation optimizes each region's function: linear regions handle I/O connections while corner portions maximize cell density without compromising connection efficiency.
2Quantity of substance
If electrode pads are arranged inwardly in n rows×n columns to increase terminal density, then the number of available terminals is improved, but the chip area available for circuit core placement is reduced
Solution Approach 1:
The patent segments the chip into distinct functional regions: linear regions for I/O cell arrangements, corner portions for additional IO cells, and a central region for circuit cores. By dividing the chip area into these non-overlapping segments, the invention allows electrode pads to be arranged inwardly in n rows×n columns without encroaching on the circuit core placeable region, as the corner portions are specifically designated for IO cell placement.
3Manufacturing precision
If the chip area is decreased to miniaturize the fabrication process, then the manufacturing precision is improved, but the space for arranging IO cells and circuit cores becomes constrained
Solution Approach 1:
The patent exploits the two-dimensional corner portions of the chip to arrange IO cells, effectively adding spatial efficiency to the miniaturized design. By utilizing the corner areas that would otherwise be wasted, the invention increases the number of IO cells that can be accommodated on a smaller chip area, thereby supporting fabrication miniaturization without sacrificing I/O capacity or circuit core space.
Data Source
AI summary
A semiconductor integrated circuit chip mounted on a substrate by flip chip bonding includes: a plurality of electrode pads; a corner portion of a flat periphery of an inner layer; a first linear region adjoining one side of the corner portion; a second linear region adjoining another side of the corner portion; and a third linear region adjoining a side of the first linear region opposite to the side adjoining the corner portion. A circuit core placeable region is provided in at least part of the corner portion and the first linear region. A plurality of IO cells connected to the electrode pads are arranged in the second and third linear regions. The IO cells in the second linear region are connected to the electrode pads arranged inwardly in n rows×n columns from a corner of the chip above the corner portion.