Chip Corner Quality via Penetration Holes at Cutting Line Intersections
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Solution Overview
Problem
The existing chip production methods face quality deterioration issues at the corners of silicon chips due to the interference of laser light irradiation during the formation of modified regions, particularly when rectangular shapes are desired, leading to potential damage and reduced quality.
Innovation Solution
A chip production method that involves forming a mask to expose intersection regions, removing these regions, and creating penetration holes before forming modified regions along cutting lines, allowing for controlled laser light irradiation to prevent interference and damage, thereby improving corner quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light irradiation is performed along intersecting cutting lines to form modified regions, then chip production efficiency is improved, but corner quality deteriorates due to repeated irradiation at intersections
Solution Approach 1:
The patent applies preliminary action by forming penetration holes at intersection regions before performing laser irradiation to create modified regions. This preliminary removal of intersection material prevents the accumulation of damaged zones that would occur with repeated laser passes, thereby maintaining corner quality while enabling efficient production along intersecting cutting lines.
2Measurement precision
If multiple laser irradiations are performed at intersection points to define chip corners, then cutting line precision is improved, but harmful effects accumulate causing quality deterioration
Solution Approach 1:
The patent extracts the problematic intersection regions by removing material to form penetration holes before laser processing. This extraction eliminates the harmful accumulation effect by ensuring that laser beams do not repeatedly irradiate the same intersection points, thus preventing damage buildup while maintaining precise cutting line definition.
3Ease of manufacture
If modified regions are formed along intersecting lines to enable chip cutting, then manufacturing capability is improved, but corner strength is reduced due to overlapping modified regions
Solution Approach 1:
By preliminarily forming penetration holes at intersections before creating modified regions along cutting lines, the patent prevents overlapping of modified regions at corner locations. This preliminary action ensures that chip cutting capability is maintained through proper modified region formation while corner strength is preserved by avoiding concentrated damage zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents quality deterioration at chip corners by ensuring that the laser light does not interfere with previously formed modified regions, resulting in improved corner quality and increased chip strength through controlled laser light output and chamfered corners.
Implementation Method 1
forming a modified region in the substrate along the first cutting line after the third step by relatively moving a light condensing point of a laser light along the first cutting line with respect to the substrate
Implementation Method 2
relatively moving a light condensing point of a laser light along the first cutting line
Implementation Method 3
removing the intersection region from the substrate and forming a penetration hole by etching the substrate using the mask
Data Source
AI summary
A chip production method includes a first step of setting a first cutting line and a second cutting line on a substrate including a plurality of functional elements, a second step of forming a mask on the substrate such that the functional elements are covered and an intersection region including an intersection of the first cutting line and the second cutting line is exposed, a third step of removing the intersection region from the substrate and forming a penetration hole by etching the substrate using the mask, a fourth step of forming a modified region in the substrate along the first cutting line, a fifth step of forming a modified region in the substrate along the second cutting line, and a sixth step of forming chips by cutting the substrate along the first cutting line and the second cutting line.